Patents by Inventor Hideji Isobe

Hideji Isobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus
    Patent number: 6984164
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: January 10, 2006
    Assignee: Ebara Corporation
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Polishing apparatus
    Publication number: 20040224613
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Application
    Filed: June 10, 2004
    Publication date: November 11, 2004
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Polishing apparatus
    Patent number: 6764381
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: July 20, 2004
    Assignee: Ebara Corporation
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Polishing apparatus
    Publication number: 20030171071
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Application
    Filed: March 17, 2003
    Publication date: September 11, 2003
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Polishing apparatus
    Patent number: 6558229
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: May 6, 2003
    Assignee: Ebara Corporation
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Polishing apparatus
    Publication number: 20010008827
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 19, 2001
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa