Patents by Inventor Hidekatsu Hatanaka
Hidekatsu Hatanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8207442Abstract: In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.Type: GrantFiled: April 18, 2007Date of Patent: June 26, 2012Assignee: ITN Energy Systems, Inc.Inventors: Lawrence M. Woods, Joseph H. Armstrong, Rosine M. Ribelin, Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Nicole R. Anderson, Herschel Henry Reese
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Publication number: 20110177342Abstract: A cured organopolysiloxane resin film having gas barrier properties in which a layer of cured organopolysiloxane that contains an organic functional group, an organic group produced by the polymerization of polymerizable organic functional groups, or the hydrosilyl group or silanol group, is formed on a visible region-transparent film comprising cured organopolysiloxane resin yielded by hydrosilylation reaction-mediated crosslinking, and in which a silicon oxynitride layer, silicon nitride layer, or silicon oxide layer is formed on the aforementioned layer of cured organopolysiloxane. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties.Type: ApplicationFiled: June 26, 2009Publication date: July 21, 2011Inventors: Maki Itoh, Michitaka Suto, Nobuo Kushibiki, Hidekatsu Hatanaka, Katsuya Eguchi, Dimitris Elias Katsoulis
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Patent number: 7550548Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) 100 parts by weight of an organopolysiloxane having a viscosity of from 100 to 500,000 mPa·s at 25° C. and having in one molecule 1.5 or more end groups represented by the general formula: (X)aR13-aSi—, where each X is independently a hydroxyl group or a hydrolyzable group, each R1 is independently a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group, and a is 1, 2, or 3; (B) 0.01 to 40 parts by weight of a cross-linking agent selected from a silane or a siloxane oligomer where the cross-linking agent has three or more silicon-bonded hydrolyzable groups per molecule; and (C) microparticles of thermoplastic resin containing a platinum compound in such an amount that the content of metallic platinum in component (C) is within the range of 0.01 to 5 wt. %, where the microparticles have an average diameter from 0.Type: GrantFiled: June 20, 2007Date of Patent: June 23, 2009Assignee: Dow Corning Toray Company, Ltd.Inventors: Hidekatsu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koji Nakanishi
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Publication number: 20090084428Abstract: A copper indium diselenide (CIS)-based photovoltaic device includes a CIS-based solar absorber layer including copper, indium, and selenium. The CIS-based photovoltaic device further includes a substrate including a silicone layer formed from a silicone composition and a metal foil layer. The substrate, due to the presence of the silicone layer and the metal foil layer, is both flexible and sufficiently able to withstand annealing temperatures in excess of 500° C. to obtain maximum efficiency of the device.Type: ApplicationFiled: April 18, 2007Publication date: April 2, 2009Inventors: Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Lawrence M. Woods, Joseph H. Armstrong, Rosine M. Ribelin
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Publication number: 20080115827Abstract: In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.Type: ApplicationFiled: April 18, 2007Publication date: May 22, 2008Applicants: ITN ENERGY SYSTEMS, INC., DOW CORNING CORPORATIONInventors: Lawrence M Woods, Joseph H. Armstrong, Rosine M. Ribelin, Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Nicole R. Anderson, Herschel Henry Reese
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Publication number: 20070244287Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).Type: ApplicationFiled: June 20, 2007Publication date: October 18, 2007Applicant: DOW CORNING TORAY COMPANY, LTD.Inventors: Hidekatsu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koji Nakanishi
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Patent number: 7250467Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).Type: GrantFiled: July 26, 2002Date of Patent: July 31, 2007Assignee: Dow Corning Toray Silcone Co., Ltd.Inventors: Hidekatsu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koji Nakanishi
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Patent number: 6699925Abstract: A flame-retardant thermoplastic resin composition comprising (A) 100 weight parts of a thermoplastic resin, (B) 10 to 300 weight parts of particulate metal hydroxide; (C) 0.01 to 50 weight parts of a branched polyorganosiloxane having alkoxy groups and described by average unit formula R1a(R2O)bSiO(4−a−b)/2, where R1 and R2 are monovalent hydrocarbon groups selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number; b is a positive number; and a+b is a number from 0.75 to 2.5; (D) 0.01 to 50 weight parts of a branched polyorganosiloxane having silanol groups and described by average unit formula R3a(HO)bSiO(4−a−b)/2, where R3 is a monovalent hydrocarbon group selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number, b is a positive number, and a+b is a number from 0.75 to 2.5; and (E) 0.01 to 10 weight parts of a condensation reaction promoting catalyst.Type: GrantFiled: August 23, 2001Date of Patent: March 2, 2004Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Hidekatsu Hatanaka, Koji Nakanishi, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Yoshitsugu Morita
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Publication number: 20030114569Abstract: A polyolefin-based resin composition comprising (A) 100 parts by weight of a polyolefin-based resin, (B) 10 to 200 parts by weight of a metal hydroxide powder, (C) 0.01 to 50 parts by weight of a powdery material consisting of (i) a liquid organopolysiloxane having at least one silicon-bonded hydrogen atom per molecule and (ii) an inorganic powder other than a metal hydroxide, and (D) a platinum-based catalyst in an amount sufficient to provide 0.1 to 10,000 ppm of platinum metal based on the total weight of component (A) and component (B); and a process for the production thereof.Type: ApplicationFiled: October 31, 2001Publication date: June 19, 2003Inventors: Yoshitsugu Morita, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Hidekatsu Hatanaka, Koji Nakanishi
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Patent number: 6534576Abstract: A flame retardant organic resin composition comprising (A) 100 parts by weight of an aromatic ring-containing organic resin and (B) 0.01-50 parts by weight of a branched organopolysiloxane described by average molecular formula (R13SiO1/2)a(R2SiO3/2)b(SiO4/2)c(R3O1/2)d(HO1/2)e, where each R1 is independently selected from alkyl groups comprising 1 to 12 carbon atoms and alkenyl groups comprising 2 to 12 carbon atoms; each R2 is independently selected from alkyl groups comprising 1 to 12 carbon atoms, alkenyl groups comprising 2 to 12 carbon atoms, and aryl groups comprising 6 to 12 carbon atoms, where the aryl groups of R2 are at least 30 mol % based on total monovalent hydrocarbon in R1 and R2, R3 represents an alkyl group, subscripts a and b are positive numbers, and subscripts c, d, and e are 0 or positive numbers.Type: GrantFiled: July 17, 2001Date of Patent: March 18, 2003Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Koji Nakanishi, Hidekatsu Hatanaka, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Yoshitsugu Morita
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Publication number: 20020077400Abstract: A flame retardant organic resin composition comprisingType: ApplicationFiled: July 17, 2001Publication date: June 20, 2002Inventors: Koji Nakanishi, Hidekatsu Hatanaka, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Yoshitsugu Morita
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Publication number: 20020045695Abstract: A flame-retardant thermoplastic resin composition comprising (A) 100 weight parts of a thermoplastic resin, (B) 10 to 300 weight parts of particulate metal hydroxide; (C) 0.01 to 50 weight parts of a branched polyorganosiloxane having alkoxy groups and described by average unit formula R1a(R2O)bSiO(4-a-b)/2, where R1 and R2 are monovalent hydrocarbon groups selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number; b is a positive number; and a+b is a number from 0.75 to 2.5; (D) 0.01 to 50 weight parts of a branched polyorganosiloxane having silanol groups and described by average unit formula R3a(HO)bSiO(4-a-b)/2, where R3 is a monovalent hydrocarbon group selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number, b is a positive number, and a+b is a number from 0.75 to 2.5; and (E) 0.01 to 10 weight parts of a condensation reaction promoting catalyst.Type: ApplicationFiled: August 23, 2001Publication date: April 18, 2002Inventors: Hidekatsu Hatanaka, Koji Nakanishi, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Yoshitsugu Morita
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Publication number: 20020013395Abstract: A flame-retardant polyolefin-based resin composition, a method for making the composition, and a flame retardant cable coated with the composition. The flame-retardant polyolefin-based resin composition comprises (A) 100 weight parts polyolefin-based resin, (B) 10 to 200 weight parts particulate metal hydroxide, (C) 0.01 to 50 weight parts of an organosilicon compound having at least one hydrosilyl group, and (D) a platinum-based catalyst in an amount of 0.1 ppm to 10,000 ppm in terms of platinum metal per weight part of components (A) and (B) combined.Type: ApplicationFiled: April 25, 2001Publication date: January 31, 2002Inventors: Hidekatsu Hatanaka, Koji Nakanishi, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Yoshitsugu Morita
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Publication number: 20010044484Abstract: A flame retardant organic resin composition comprising (A) 100 parts by weight of an aromatic ring-containing organic resin and (B) 0.01 to 50 parts by weight of a branched organopolysiloxane described by average molecular formula (R12SiO2/2)a(R2SiO3/2)b(SiO4/2)c(R33O1/2)d(HO1/2)e, where R1, R2, and R3 are monovalent hydrocarbon groups selected from the group consisting of alkyl groups comprising 1 to 12 carbon atoms, alkenyl groups comprising 1 to 12 carbon atoms, and aryl groups comprising 6 to 12 carbon atoms, the content of aryl groups as a proportion of all the monovalent hydrocarbon groups is in a range of 20 mol % to 80 mol %, subscripts a and b are positive numbers, and subscripts c, d, and e are 0 or positive numbers, having a weight average molecular weight within a range of 300 to 10,000, and in which the content of silicon-bonded hydroxyl groups is not more than 1 wt %.Type: ApplicationFiled: February 20, 2001Publication date: November 22, 2001Inventors: Hidekatsu Hatanaka, Koji Nakanishi, Haruhiko Furukawa, Koji Shiromoto, Hiroshi Ueki, Yoshitsugu Morita
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Patent number: 6303681Abstract: A flame-retardant polyolefin-type resin composition comprising (A) 100 weight parts polyolefin-type resin, (B) 30 to 200 weight parts powder of a hydrated metal compound, and (C) 0.01 to 50 weight parts branched organopolysiloxane with average unit formula RaSiO(4−a)/2 where each R is a selected from the group consisting of monovalent organic groups selected from the group consisting of C1 to C12 alkyl and C6 to C12 aryl and hydroxyl, wherein aryl constitutes from 50 to 100 mole % of the total monovalent organic groups and the hydroxyl content in each molecule is from 1 to 10 weight %, a is a number from 0.75 to 2.5, and the organopolysiloxane contains at least one RSiO3/2 siloxane unit in each molecule, where R is as previously described. The composition is useful as a flame-retardant coating on electrical cables.Type: GrantFiled: September 15, 2000Date of Patent: October 16, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Haruhiko Furukawa, Hidekatsu Hatanaka, Koji Shiromoto, Hiroshi Ueki, Koji Nakanishi, Yoshitsugu Morita
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Patent number: 5705587Abstract: A room-temperature-curable silicone elastomer composition obtained from diorganopolysiloxane that is endblocked by silanol at both molecular chain terminals and diorganopolysiloxane that is endblocked at one molecular chain terminal by silanol and at the other terminal by trialkylsiloxy; an alkoxy functional silane; an organopolysiloxane resin; a curing catalyst; and a diorganopolysiloxane that contains at least 2 carboxyl groups. The room-temperature-curable silicone elastomer composition has an excellent pre-cure workability and cures into a low-modulus, high-elongation silicone elastomer.Type: GrantFiled: January 30, 1997Date of Patent: January 6, 1998Assignee: Dow Corning Toray Silicone Co., LTD.Inventors: Hidekatsu Hatanaka, Seiji Hori
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Patent number: 5665805Abstract: A room temperature curing silicone elastomer composition with superior workability before curing which forms a silicone elastomer of a low modulus and high elongation after curing. A room temperature curing silicone elastomer composition prepared from a diorganopolysiloxane having both terminals of the molecular chains blocked by silanol groups, a diorganopolysiloxane having one terminal of the molecular chain blocked by a silanol group and the other terminal blocked by a trialkylsiloxy group, (B) an organosilane, (C) an organopolysiloxane resin, (D) a curing catalyst and (E) a higher fatty acid.Type: GrantFiled: November 8, 1996Date of Patent: September 9, 1997Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Hidekatsu Hatanaka, Seiji Hori
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Patent number: 5514765Abstract: A room temperature-curing silicone elastomer composition which has excellent workability before curing and forms a silicone elastomer after curing which exhibits low modulus and high elongation. This composition contains a hydroxyl-capped polydiorganosiloxane, a siloxane chain extender of the formulaR.sup.1 (R.sup.2.sub.n R.sup.3.sub.(3-n) SiO)Si(OR.sup.4).sub.2in which R.sup.1, R.sup.2, and R.sup.3 are aliphatic monovalent hydrocarbon groups, R.sup.4 is a hydrocarbon group having from 1 to 8 carbon atoms per group, and n is 0 or 1, an alkoxysilane crosslinker, and a curing catalyst.Type: GrantFiled: July 19, 1995Date of Patent: May 7, 1996Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Seiji Hori, Hidekatsu Hatanaka, Toshio Saruyama
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Patent number: 5405889Abstract: A room-temperature-curable organopolysiloxane composition having a highly durable adhesion that bonds well to various substrates, e.g. glass, plastics, and metals, through contact-curing and exhibits an excellent early-cure adhesiveness and that cures to give a silicone rubber that is highly water-resistant and exhibits long-term retention of its bonding strength even in hostile ambients, e.g. immersion in hot water, comprises a composition of a hydroxyl-terminated or alkoxy-terminated organopolysiloxane, an inorganic filler, a rosin ester in which the ester is a polyol, a reaction mixture from aminoalkylalkoxysilane and epoxyalkylalkoxysilane, and a curing catalyst.Type: GrantFiled: March 1, 1993Date of Patent: April 11, 1995Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Hidekatsu Hatanaka, Noriyuki Suganuma