Patents by Inventor Hidekatsu Ozawa

Hidekatsu Ozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9269058
    Abstract: Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1?N?“the maximum number of holes to be drilled in the area”?1?) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3).
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: February 23, 2016
    Assignee: Via Mechanics, Ltd.
    Inventor: Hidekatsu Ozawa
  • Publication number: 20150021304
    Abstract: Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1?N?“the maximum number of holes to be drilled in the area”?1?) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3).
    Type: Application
    Filed: July 18, 2013
    Publication date: January 22, 2015
    Inventor: Hidekatsu OZAWA
  • Patent number: 5064985
    Abstract: The method for controlling the withdrawal of the electrode in an NC electric-discharge machine permits a linear withdrawal of the electrode to a forward position at least two blocks preceding the present forward position from the workpiece according to a withdrawal command received by the NC unit and with a high efficiency while a workpiece is being machined with electric discharges made between the electrode and the workpiece with the former being forwarded in relation to the latter according to a control information including positioning commands given to the NC unit for each block.
    Type: Grant
    Filed: December 29, 1989
    Date of Patent: November 12, 1991
    Assignee: Hitachi Seiko, Ltd.
    Inventors: Hideyoshi Yoshizawa, Takashi Ishii, Toshiyuki Makino, Hidekatsu Ozawa, Yasuyuki Shimizu