Patents by Inventor Hidekazu Chiba

Hidekazu Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920325
    Abstract: A construction machine is provided that can cause each hydraulic actuator to accurately operate according to operation by an operator in combined operation in which a hydraulic fluid of a hydraulic pump is subjected to flow dividing and is supplied to plural hydraulic actuators. A controller 10, in a case of determining that combined operation is being carried out, controls a regulator 7a in such a manner that the delivery flow rate of a hydraulic pump 7 becomes larger than the total target flow rate of plural hydraulic actuators 4a, 5a, and 6a, and controls the respective opening amounts of plural directional control valves 8a1, 8a3, and 8a5 in such a manner that the difference between the respective target flow rates of the plural hydraulic actuators and the respective inflow flow rates of the plural hydraulic actuators sensed by velocity sensors 12 to 14 becomes small.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 5, 2024
    Assignee: HITACHI CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Akira Kanazawa, Hidekazu Moriki, Takaaki Chiba, Shinya Imura
  • Patent number: 6357650
    Abstract: A method of wire-bonding between a pad on a semiconductor chip and a pad on a circuit board on which the semiconductor device is mounted, includes clamping a wire between a pair of clamping electrodes, each having a rectangular main surface, applying a first electric potential to the wire with a torch rod, applying a second electric potential directly to the wire with the clamping electrodes, so as to form a melted ball at a tip of the wire, solidifying the melted ball, unclamping the wire, pressing the solidified ball with a capillary against the pad on the circuit board, vibrating the wire ultrasonically to bond the solidified ball to the pad of the circuit board, moving the wire whose tip is bonded to the pad of the circuit board, with the capillary on the pad of the semiconductor chip, vibrating the wire ultrasonically to bond the wire to the pad of the semiconductor chip, and clamping the wire between the clamping electrodes again, and moving the clamping electrodes away from the pad of the semiconductor
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: March 19, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Hidekazu Chiba
  • Patent number: 6173879
    Abstract: A wire bonder includes a cut clamper having a pair of supporting members and a pair of electrodes formed in rectangular shape. Each electrode is rotatably connected to the supporting member. Each electrode has an uneven surface. A heater is incorporated in one or both of supporting.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: January 16, 2001
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Hidekazu Chiba