Patents by Inventor Hidekazu Idei

Hidekazu Idei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMOPLASTIC RESIN COMPOSITION AND MEMBER, AND METHOD OF MANUFACTURING MEMBER FORMED FROM THERMOPLASTIC RESIN COMPOSITION AND METHOD OF ENHANCING MECHANICAL STRENGTH
    Publication number: 20230250255
    Abstract: Provided is a thermoplastic resin composition obtained by melt-kneading at least 0.1 to 0.5 parts by mass of a carbon nanostructure relative to 100 parts by mass of a thermoplastic resin; a member formed by molding the thermoplastic resin composition; a method of manufacturing a member including steps of preparing the thermoplastic resin composition, and molding the thermoplastic resin composition into a predetermined shape; and a method of enhancing mechanical strength of a member formed from a thermoplastic resin composition by using a resin composition obtained by melt-kneading 0.1 to 0.5 parts by mass of a carbon nanostructure relative to 100 parts by mass of a thermoplastic resin.
    Type: Application
    Filed: June 14, 2021
    Publication date: August 10, 2023
    Applicant: Polyplastics Co., Ltd.
    Inventors: Yuuki Kanda, Hidekazu Idei
  • METHOD OF SUPPRESSING BURR OF POLYARYLENE SULFIDE RESIN COMPOSITION
    Publication number: 20230242762
    Abstract: Provided is a method of suppressing burrs that occur during injection-molding of a polyarylene sulfide resin composition, including: adding at least 0.01 to 5 parts by mass of a carbon nanostructure to 100 parts by mass of a polyarylene sulfide resin and melt-kneading at least the carbon nanostructure and the polyarylene sulfide resin.
    Type: Application
    Filed: June 22, 2021
    Publication date: August 3, 2023
    Applicant: POLYPLASTICS CO., LTD.
    Inventors: Hidekazu IDEI, Katsuhei OHNISHI