Abstract: An outer surface of an object 23 is irradiated with visible light from a light source 21, and the reflected light is acquired by a TV camera 24. A two-dimensional image with gradation is Fourier transformed by an image analyzer 20. The brightness and darkness of the image are bipolarized using an emphasis coefficient in a predetermined wavelength range in the process of Fourier transform. The bright regions and dark regions forming closed regions are calculated separately as regions representing gloss irregularity or printing unevenness, thereby outputting a statistical parameter of the areas as a measured result.

Abstract: In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member of metal. In this case, the bonding between the mold and the back-up member is much assured when metal balls are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a conductive plastic paint before being subjected to the electric metal plating in an electrolytic solution.

Abstract: A master batch of hardener for curable one-package epoxy resin system which comprises (I) a hardener consisting of(I) a hardener consisting of(i) a powder of an amine compound (A) as a core having at least one tertiary amino group in the molecule while having no primary and secondary amino groups, the powder having both a group (X) capable of absorbing infrared rays of 1630 to 1680 cm.sup.-1 in wave length and a group (Y) capable of absorbing infrared rays of 1680 to 1725 cm.sup.-1 in wave length at least on the surface of the powder, and(ii) a reaction product of the amine compound (A) and an epoxy resin as a shell; and(II) an epoxy resin (B) in a ratio of 10 to 50,000 parts by weight to 100 parts by weight of the hardener (I).A hardener containing the master batch is also disclosed.

Abstract: There is provided a novel polymaleimide compound represent by the formula (a) ##STR1## The present polymaleimide compound has a curability comparable to that of an epoxy resin. In addition, it is noted that a cured product prepared from the present polymaleimide compound is excellent in heat resistance and adhesion property and has a low linear expansion coefficient as compared with an epoxy resin. The above-mentioned excellent characteristics of the present polymaleimide compound are never observed with respect to conventional maleimide resins. There is also provided specific compositions containing the present polymaleimide compound for exerting the excellent effects of the present polymaleimide compound most effectively.

Abstract: An aqueous dispersion composition is described, which is prepared by uniformly mixing (A) a mixture of aromatic compounds having an average of at least 0.5 epoxy groups and from 0.1 to 1.5 acryloyl or methacryloyl groups in the molecule, and (B) at least one ethylenic monomer, and then polymerizing the mixture. In other embodiments, the composition can contain a polyamine-based hardener, and additionally, a resin, e.g., a phenol resin and a terpene resin. This composition has excellent storage stability and can provide a coating film having excellent water resistance, heat resistance, and adhesiveness.

Abstract: An epoxy resin composition comprising(1) about 20 to about 80% by weight of a solid epoxy resin, and(2) about 80 to about 20% by weight of a solid resole-type phenolic resin having a softening point of about 70.degree. to about 90.degree. C., a gel time at 150.degree. C. of at least about 80 seconds and a methylol index of about 25 to about 45, said phenolic resin being a condensation product of 1 mol of a phenol with 1 to about 4 mols of an aldehyde.