Patents by Inventor Hidekazu Kabaya

Hidekazu Kabaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100237536
    Abstract: A mold for in-mold coating is provided that can ensure a space through which a coating material for performing in-mold coating flows. The mold for in-mold coating includes an undercut-shaped recess 15 formed of a wall portion 15a provided in a mold opening direction and an inclined wall portion 15b provided to face the wall portion 15a at a predetermined angle ?2 in a region corresponding to an end or a corner portion of a product.
    Type: Application
    Filed: March 9, 2010
    Publication date: September 23, 2010
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Susumu HORINAKA, Masato NOGUCHI, Tomohiko SHIGIHARA, Yasuki OKANEMASA, Hidekazu KABAYA, Ayato UEHA, Yasuhiko TANGE
  • Patent number: 5760125
    Abstract: A resin composition which has improved resistance to yellowing due to light without loss of the superior characteristics of polyphenylene ether polyamide resins comprises(A) a polyphenylene ether resin,(B) a polyamide resin,(C) a styrene thermoplastic resin,(D) a pigment;wherein the styrene thermoplastic resin and the pigment are dispersed in the polyphenylene ether resin and the polyphenylene ether resin is a particulate dispersion in the polyamide resin. The composition may further comprise a rubber polymer wherein the rubber polymer is dispersed in the polyphenylene ether resin.
    Type: Grant
    Filed: December 11, 1996
    Date of Patent: June 2, 1998
    Assignee: General Electric Company
    Inventors: Takashi Ohtomo, Hiromi Ishida, Hidekazu Kabaya, Hiroshi Kubo
  • Patent number: 5475049
    Abstract: Resin composition comprising 8-10 parts by weight of a polyphenylene ether resin, 90-20 parts by weight of a polyamide resin, and 30-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and the polyamide resin combined, of a plate or flake like inorganic filler wherein the inorganic filler has an average particle size of no more than 5 .mu.m and as aspect ratio of no less than 3 and wherein the difference between the crystallization initiation temperature of a composition comprising 90 weight percent polyamide and 10 weight percent of the inorganic filler and the crystallization initiation temperature of the polyamide resin is 5.degree. C. or less. The resin compositions have excellent surface smoothness, high rigidity, a small linear expansion coefficient, and good impact resistance, heat resistance and chemical resistance.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: December 12, 1995
    Assignee: General Electric Company
    Inventors: Takashi Ohtomo, Hiromi Ishida, Hidekazu Kabaya, Hiroshi Kubo
  • Patent number: 5397838
    Abstract: The present inventions provides polyphenylene ether (PPE)/polyamide (PA) resin compositions having excellent dimensional stability when they absorb moisture, and good mechanical and other properties. Resin compositions of (A) 10-80 wt. parts PPE resins and (B) 90-20 wt. parts PA resins, in which the PA resins (a) are polymers formed by condensation of linear aliphatic diamines with linear aliphatic dicarboxylic acids and aromatic dicarboxylic acids, and (b) have terminal amino group contents of at least 0.4 mequiv/g.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: March 14, 1995
    Assignee: General Electric Company
    Inventors: Takashi Ohtomo, Hiromi Ishida, Hidekazu Kabaya
  • Patent number: 5389714
    Abstract: Resin compositions comprising (A) polyethylene ether resins, (B) polyamide resins, (C) elastomeric substances, and (D) needle-shaped titanium oxide are disclosed. The disclosed resins exhibit an excellent balance of stiffness and impact resistance, low linear coefficient of expansion, and good heat resistance, oil resistance, forming processability and molding surface appearance.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: February 14, 1995
    Assignee: GE Plastics, Japan, Ltd.
    Inventors: Takashi Ohtomo, Hiromi Ishida, Hidekazu Kabaya, Hiroshi Kubo
  • Patent number: 5310821
    Abstract: A resin composition is provided which contains (A) 5-80 weight parts polyphenylene ether resins and (B) 20-90 weight parts polyamide resins, wherein the (B) polyamide resins: (a) comprise 1-50 weight percent of polyamide resins having a number-average molecular weight not greater than 11,000, and a terminal amino group content of at least 7.0.times.10.sup.-5 mole/g, and (b) have an overall number-average molecular weight of 9,500 to 32,000, and a terminal amino group content of 5.5.times.10.sup.-5 mole/g or less. The resin compositions have both good impact resistance (in particular at low temperatures) and good melt flow. The resin compositions can be used in a wide range of applications, and so are industrially useful.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: May 10, 1994
    Assignee: GE Plastics Japan, Ltd.
    Inventors: Tetsuji Kodaira, Hiromi Ishida, Hidekazu Kabaya
  • Patent number: 5292789
    Abstract: A polyphenylene sulfide/polyphenylene ether composition is provided, which has excellent dimensional stability and impact resistance, as well as good heat resistance, rigidity and surface appearance. The composition also includes certain polyamide resins, hydrogenated conjugated diene/aromatic monovinyl block copolymers, modified polyolefins, compatibilizer agents, and inorganic fillers.
    Type: Grant
    Filed: May 15, 1992
    Date of Patent: March 8, 1994
    Assignee: GE Plastics Japan, Ltd.
    Inventors: Hiromi Ishida, Hidekazu Kabaya
  • Patent number: 5214083
    Abstract: Blends of polyphenylene sulfides, polyphenylene ethers and certain polyamides are made more compatible by incorporating in the polymeric blend either citric, malic or agaricic acid or one of their derivatives, trimellitic anhydride acid chloride, oxazolinyl or epoxy-containing ethylenically unsaturated compounds, or oxazolinyl or epoxy-containing polymers.
    Type: Grant
    Filed: August 15, 1991
    Date of Patent: May 25, 1993
    Assignee: General Electric Company
    Inventors: Tetsuji Kodaira, Hiromi Ishida, Hidekazu Kabaya