Abstract: A substrate processing apparatus includes a transfer device configured to transfer at least one substrate as a processing target; a transfer controller configured to control the transfer device to perform a normal transfer of transferring the substrate and a high-accuracy transfer of transferring the substrate with higher positioning accuracy as compared to the normal transfer; a warm-up controller configured to control the transfer device to perform a warm-up operation, which is different from the normal transfer and the high-accuracy transfer, when necessary; and a necessity determination unit configured to make a determination that the warm-up operation is required as a beginning of the high-accuracy transfer is approaching when a duration of a stop state of the transfer device exceeds a preset reference time.

Abstract: A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.

Abstract: A substrate processing apparatus includes a transfer device configured to transfer at least one substrate as a processing target; a transfer controller configured to control the transfer device to perform a normal transfer of transferring the substrate and a high-accuracy transfer of transferring the substrate with higher positioning accuracy as compared to the normal transfer; a warm-up controller configured to control the transfer device to perform a warm-up operation, which is different from the normal transfer and the high-accuracy transfer, when necessary; and a necessity determination unit configured to make a determination that the warm-up operation is required as a beginning of the high-accuracy transfer is approaching when a duration of a stop state of the transfer device exceeds a preset reference time.

Abstract: A substrate treatment system comprise a treatment station having a plurality of treatment units provided at multiple tiers in an up-down direction, a cassette mounting table on which a cassette housing a plurality of wafers W is mounted, and a wafer transfer mechanism arranged between the treatment station and the cassette mounting table, wherein a delivery block in which a plurality of delivery units are provided at multiple tiers is provided between the treatment station and the wafer transfer mechanism, the delivery units temporarily housing a wafer to be transferred between the cassette mounting table and the treatment station and a wafer to be transferred between the tiers of the treatment units. The wafer transfer mechanism includes a first transfer arm that transfers a wafer between the cassette mounting table and the delivery block, and a second transfer arm that transfers a wafer between the tiers of the delivery units.

Abstract: A substrate processing apparatus includes: a carrier block including first and second carrier placement units spaced apart in a right and left direction; a processing block having a layered structure in which a plurality of layered parts are vertically arranged, the layered parts each including a substrate transport mechanism for transporting a substrate and a processing module for processing a substrate; a tower unit including plural substrate placement units located at height positions where a substrate is transferred by the substrate transport mechanism of the layered part corresponding to the substrate placement unit; a first substrate transfer mechanism configured to transfer a substrate between the carrier on the first carrier placement unit and the substrate placement unit of the tower unit; and a second substrate transfer mechanism configured to transfer a substrate between the carrier on the second substrate placement unit and the substrate placement unit of the tower unit.

Abstract: A substrate processing apparatus includes: a carrier block including first and second carrier placement units spaced apart in a right and left direction; a processing block having a layered structure in which a plurality of layered parts are vertically arranged, the layered parts each including a substrate transport mechanism for transporting a substrate and a processing module for processing a substrate; a tower unit including plural substrate placement units located at height positions where a substrate is transferred by the substrate transport mechanism of the layered part corresponding to the substrate placement unit; a first substrate transfer mechanism configured to transfer a substrate between the carrier on the first carrier placement unit and the substrate placement unit of the tower unit; and a second substrate transfer mechanism configured to transfer a substrate between the carrier on the second substrate placement unit and the substrate placement unit of the tower unit.