Patents by Inventor Hidekazu Konogi

Hidekazu Konogi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5914517
    Abstract: A semiconductor device and a method of manufacturing the same. The semiconductor device comprises: a semiconductor substrate; an impurity injection layer formed in a surface of the semiconductor substrate; and a trench formed in the impurity injection layer for defining a plurality of element formation regions isolated one another by the trench, wherein the impurity injection layer extends to a depth inside the semiconductor substrate deeper at a first area below the trench than at a second area below each of the element formation regions.
    Type: Grant
    Filed: May 9, 1997
    Date of Patent: June 22, 1999
    Assignee: Nippon Steel Corporation
    Inventor: Hidekazu Konogi