Patents by Inventor Hidekazu Matuura

Hidekazu Matuura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat curable resin composition
    Patent number: 4985509
    Abstract: A heat curable resin composition comprising (A) a polyimide and (B) a polymaleimide is excellent in heat resistance and suitable for use as a film-shaped adhesive, a laminate or a molding material.
    Type: Grant
    Filed: May 12, 1989
    Date of Patent: January 15, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Hidekazu Matuura, Yasuo Miyadera, Toshihiko Kato