Hidekazu OHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A sensor includes a metal housing and a metal lid. The metal housing houses a circuit board electrically connected to a sensor element and is provided with an opening and an edge part defining the opening. The metal lid is adhered to the edge part to cover the opening. At least one of the edge part and the metal lid is provided with one or more recesses, and the metal lid is adhered to the edge part by a portion of an adhesive agent filled in the recess that is located in a region of an opening end of the recess.
Abstract: A sensor includes a metal housing and a metal lid. The metal housing houses a circuit board electrically connected to a sensor element and is provided with an opening and an edge part defining the opening. The metal lid is adhered to the edge part to cover the opening. At least one of the edge part and the metal lid is provided with one or more recesses, and the metal lid is adhered to the edge part by a portion of an adhesive agent filled in the recess that is located in a region of an opening end of the recess.
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