Abstract: A lid and an insulating bonding layer that seal a piezoelectric vibrator on a substrate are bonded with higher strength. A piezoelectric vibration component includes a substrate having a principal surface on which a piezoelectric vibrator is mounted, an insulating film disposed on the principal surface, a lid having a recess opening toward the principal surface and an edge portion around the recess. Moreover, first and second insulating bonding layers are interposed between the lid and the substrate. The first and second insulating bonding layers are joined together between the edge portion and the insulating film so as to seal the piezoelectric vibrator in a space between the recess and the principal surface.

Abstract: A lid and an insulating bonding layer that seal a piezoelectric vibrator on a substrate are bonded with higher strength. A piezoelectric vibration component includes a substrate having a principal surface on which a piezoelectric vibrator is mounted, an insulating film disposed on the principal surface, a lid having a recess opening toward the principal surface and an edge portion around the recess. Moreover, first and second insulating bonding layers are interposed between the lid and the substrate. The first and second insulating bonding layers are joined together between the edge portion and the insulating film so as to seal the piezoelectric vibrator in a space between the recess and the principal surface.

Abstract: A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

Abstract: A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

Abstract: A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

Abstract: There is provided an electronic component in which sealing members are bonded with a resin adhesive and the resin adhesive rarely spreads before curing, and a manufacturing method for an electronic component in which a resin adhesive rarely spreads before curing. An electronic component having a first sealing member and a second sealing member bonded to a principal surface of the first sealing member to form a sealed space, a resin adhesive layer that bonds the first sealing member and the second sealing member on a frame-shaped bonding region of the principal surface, a frame-shaped glass layer provided between the frame-shaped bonding region and a peripheral edge portion of the first sealing member, and an electronic component body provided in the sealed space.

Abstract: A piezoelectric power generator that includes a piezoelectric laminate in which a plurality of rectangular-shaped piezoelectric elements each having electrodes formed on a substrate are connected at both ends thereof to each other, and in which a portion other than connection portions is capable of vibrating. In the piezoelectric laminate, a portion of the element at the uppermost layer is a fixed portion, and a weight is mounted to the element (free end) at the lowermost layer. Each piezoelectric element is decreased in rigidity from the element at the uppermost layer toward the element at the lowermost layer.

Abstract: A piezoelectric power generator that includes a piezoelectric laminate in which a plurality of rectangular-shaped piezoelectric elements each having electrodes formed on a substrate are connected at both ends thereof to each other, and in which a portion other than connection portions is capable of vibrating. In the piezoelectric laminate, a portion of the element at the uppermost layer is a fixed portion, and a weight is mounted to the element (free end) at the lowermost layer. Each piezoelectric element is decreased in rigidity from the element at the uppermost layer toward the element at the lowermost layer.