Patents by Inventor Hidekazu Shigeyoshi

Hidekazu Shigeyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid contact member, method for producing same, member for analyzers, analyzer, sliding member, and sliding device
    Patent number: 11878946
    Abstract: Object To provide a liquid contact member having high hydrophilicity and exhibiting high dirt removal efficiency by cleaning. Solution A liquid contact member includes a ceramic including a plurality of crystal grains and a grain boundary phase, and the concentration of silicon on a liquid contact surface of the ceramic is higher than that of silicon on a virtual internal surface parallel to the liquid contact surface.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: January 23, 2024
    Assignee: KYOCERA Corporation
    Inventor: Hidekazu Shigeyoshi
  • LIQUID CONTACT MEMBER, METHOD FOR PRODUCING SAME, MEMBER FOR ANALYZERS, ANALYZER, SLIDING MEMBER, AND SLIDING DEVICE
    Publication number: 20220402823
    Abstract: Object To provide a liquid contact member having high hydrophilicity and exhibiting high dirt removal efficiency by cleaning. Solution A liquid contact member includes a ceramic including a plurality of crystal grains and a grain boundary phase, and the concentration of silicon on a liquid contact surface of the ceramic is higher than that of silicon on a virtual internal surface parallel to the liquid contact surface.
    Type: Application
    Filed: November 27, 2020
    Publication date: December 22, 2022
    Inventor: Hidekazu SHIGEYOSHI
  • Wedge bonding component
    Patent number: 10147701
    Abstract: There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: December 4, 2018
    Assignee: KYOCERA CORPORATION
    Inventor: Hidekazu Shigeyoshi
  • WEDGE BONDING COMPONENT
    Publication number: 20180019224
    Abstract: There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.
    Type: Application
    Filed: January 28, 2016
    Publication date: January 18, 2018
    Inventor: Hidekazu Shigeyoshi