Patents by Inventor Hidekazu Shioda

Hidekazu Shioda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation-sensitive resin composition
    Patent number: 6716564
    Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde. wherein R represents a hydroxyl group or an alkyl group with 1 to 4 carbon atoms, n is 0 or an integer of 1 to 3 and, when n is 2 or 3, each R group may be the same or different.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: April 6, 2004
    Assignee: Clariant Finance (BVI) Limited
    Inventors: Satoshi Kobayashi, Hidekazu Shioda, Haruhiko Itoh
  • Photosensitive resin composition
    Publication number: 20030003388
    Abstract: A radiation sensitive resin composition containing an alkali soluble resin and a quinonediazide group-containing photosensitizer, in which the photosensitizer comprises a mixture of two or more esters between tetrahydroxybenzophenone and 1,2-naphthoquinonediazidesulfonic acid having different esterification rates. As the photosensitizer, a mixture of photosensitizer A comprising an esterification product from tetrahydroxybenzophenone and 1,2-naphthoquinonediazide-5-sulfonic acid having an average esterification rate of X% (50≦X≦100) and photosensitizer B comprising an esterification product from tetrahydroxybenzophenone and 1,2-naphthoquinonediazide-5-sulfonic acid having an average esterification rate of Y% (25≦Y≦ (X−10)), with the mixing ratio A:B being 10-90:90-10, is preferred.
    Type: Application
    Filed: June 25, 2002
    Publication date: January 2, 2003
    Inventors: Shuichi Takahashi, Jun Ikemoto, Hidekazu Shioda, Shunji Kawato
  • Radiation-sensitive resin composition
    Publication number: 20020115741
    Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde.
    Type: Application
    Filed: December 6, 2001
    Publication date: August 22, 2002
    Applicant: Clariant Finance (BVI) Limited
    Inventors: Satoshi Kobayashi, Hidekazu Shioda, Haruhiko Itoh
  • Radiation-sensitive resin composition
    Patent number: 6342542
    Abstract: A radiation sensitive resin composition containing an alkali-soluble resin, for example a novolak-quinonediazide positive-working radiation sensitive resin composition and a chemically amplified negative-working resin composition, wherein the alkali-soluble resin contains at least an alkali-soluble resin obtained by polycondensation of a compound represented by the following general formula (I) and a phenol if necessary, with an aldehyde. wherein R represents a hydroxyl group or an alkyl group with 1 to 4 carbon atoms, n is 0 or an integer of 1 to 3 and, when n is 2 or 3, each R group may be the same or different.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: January 29, 2002
    Assignee: Clariant Finance (BVI) Limited
    Inventors: Satoshi Kobayashi, Hidekazu Shioda, Haruhiko Itoh