Patents by Inventor Hidekazu Shoji

Hidekazu Shoji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240026073
    Abstract: To provide a resin composition and a molded article. The resin composition contains a thermoplastic resin and an electrically conductive substance, wherein the resin composition formed into a molded article with a size of 100 mm×100 mm×t mm thick, provided that t is a value in a case where Concentration C (mass %) of an electrically conductive substance in the resin composition×Thickness t (mm) gives a value of 1.2 or more, has a ? absorptance of 20.0% or less, which is a difference between a maximum value and a minimum value of the absorptance in the frequency range of 28.0 GHz to 40.0 GHz; and has the absorptance of 35.0% or more at a frequency of 28.
    Type: Application
    Filed: September 28, 2023
    Publication date: January 25, 2024
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI
  • Publication number: 20230323111
    Abstract: A resin composition, a formed article, and, an electromagnetic wave absorber, may each have large electromagnetic wave absorbance. The resin composition may contain: a thermoplastic resin; and an electro-conductive substance, the resin composition, when formed to a 2 mm thick test specimen and a cross section thereof is observed under a digital microscope, giving an aggregate attributable to the electro-conductive substance, with an area percentage of the aggregate, having an equivalent circle diameter of 30 µm or larger, of 0.80% or smaller.
    Type: Application
    Filed: February 24, 2022
    Publication date: October 12, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI, Satomi KITAGAWA
  • Publication number: 20230250276
    Abstract: A resin composition including a thermoplastic resin and a carbon nanotube. The resin composition has a dielectric constant at 76.5 GHz frequency of 4.50 or larger. A method for producing the resin composition, the method including, melt-kneading the thermoplastic resin, and a masterbatch of the carbon nanotube in the thermoplastic resin.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 10, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI
  • Publication number: 20230242747
    Abstract: A resin composition containing, per 100 parts by mass of a thermoplastic resin, 0.1 to 10.0 parts by mass of a carbon nanotube, and 10 to 100 parts by mass of a glass fiber, with a mass proportion of the carbon nanotube and the glass fiber (carbon nanotube/glass fiber) being 0.01 to 0.30.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI
  • Publication number: 20220325037
    Abstract: A thermoplastic resin composition for a millimeter-wave radar member, is provided, which comprises, relative to 100 parts by mass of a polybutylene terephthalate resin (A), 15 to 65 parts by mass of a rubber-reinforced polystyrene resin (B1) and/or 10 to 70 parts by mass of a polycarbonate resin (B2) as a component (B), 0.1 to 3 parts by mass of an epoxy compound (D), and 30 to 150 parts by mass of glass fiber (E).
    Type: Application
    Filed: May 15, 2020
    Publication date: October 13, 2022
    Applicant: Mitsubishi Engineering-Plastics Corporation
    Inventor: Hidekazu SHOJI
  • Publication number: 20210292547
    Abstract: A polybutylene terephthalate resin composition, comprising comprising a thermoplastic resin (A) containing a polybutylene terephthalate resin and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 30 parts by mass of an elastomer (B), from 0.3 to 4 parts by mass of an epoxy compound (C), from 15 to 80 parts by mass of a reinforcing filler (D), and from 1 to 15 parts by mass of a masterbatch (E) containing a silicone compound with a weight-average molecular weight of 10,000 to 80,000 and a thermoplastic resin.
    Type: Application
    Filed: July 19, 2019
    Publication date: September 23, 2021
    Applicant: Mitsubishi Engineering-Plastics Corporation
    Inventors: Yasushi YAMANAKA, Hidekazu SHOJI, Rina TAKEUCHI
  • Patent number: 6762235
    Abstract: A polybutylene terephthalate resin having 30 eq/t or less of carboxyl end group, a crystallization temperature in a temperature decrease of 175° C. or higher and an amount of residual tetrahydrofuran of 300 ppm by weight or less; and compositions and molded articles comprising the resin and glass fiber, antioxidants and mold-releasing agents is provided. The polybutylene terephthalate resin can be molded in a short molding cycle, exhibits excellent resistance to hydrolysis and mold-releasing property, causes no corrosion of metals and generates little gas during molding. The compositions and the molded articles exhibit improved impact resistance, stability under heating and oxidation and mold-releasing property and can be advantageously used for members in electric and electronic products and in automobiles.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: July 13, 2004
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Kunihiro Takenaka, Ryo Saito, Hidekazu Shoji
  • Publication number: 20030069339
    Abstract: A polybutylene terephthalate resin having 30 eq/t or less of carboxyl end group, a crystallization temperature in a temperature decrease of 175° C. or higher and an amount of residual tetrahydrofuran of 300 ppm by weight or less; and compositions and molded articles comprising the resin and glass fiber, antioxidants and mold-releasing agents is provided. The polybutylene terephthalate resin can be molded in a short molding cycle, exhibits excellent resistance to hydrolysis and mold-releasing property, causes no corrosion of metals and generates little gas during molding. The compositions and the molded articles exhibit improved impact resistance, stability under heating and oxidation and mold-releasing property and can be advantageously used for members in electric and electronic products and in automobiles.
    Type: Application
    Filed: April 19, 2002
    Publication date: April 10, 2003
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Kunihiro Takenaka, Ryo Saito, Hidekazu Shoji
  • Patent number: 5519106
    Abstract: A process for preparing an aromatic polycarbonate resin from an aromatic dihydroxy compound and a carbonate diester by transesterification in the presence of a transesterification catalyst comprising; reacting a purified carbonate diester with an aromatic dihydroxy compound in the presence of a transesterification catalyst to form a polycarbonate prepolymer; said carbonate diester containing benzophenone and benzoate ester derivatives having a molecular weight of less than 1,000, each in an amount of 100 ppm or less, said polycarbonate prepolymer having a viscosity average molecular weight of 5,000 to 20,000 at a temperature of 140.degree. to 280.degree. C., the reaction pressure being from 0.1 Torr to normal pressure; polymerizing said prepolymer at a temperature of 240.degree. to 350.degree. C. in a lateral, bi-axial, self-cleaning reactor to obtain an aromatic polycarbonate resin having a viscosity average molecular weight of 15,000 to 60,000.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: May 21, 1996
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masahiro Nukui, Takao Tayama, Takeshi Kashiwagi, Masatoshi Kimura, Hidekazu Shoji
  • Patent number: 5455324
    Abstract: Disclosed herein is an aromatic polycarbonate resin containing benzophenone and benzoate ester derivatives which have a molecular weight less than 1,000, each in an amount of 100 ppm or less. Also disclosed is a process for preparing an aromatic polycarbonate resin from an aromatic dihydroxy compound and a carbonate diester in which the benzophenone derivative content is 100 ppm or less by transesterification, comprising preparing a polycarbonate prepolymer having a viscosity average molecular weight of 5,000 to 20,000 using an iminocarboxylic acid or salt thereof as a transesterification catalyst and polymerizing the prepolymer in an extruder.The aromatic polycarbonate is colorless and transparent and is suitable for extrusion molding.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: October 3, 1995
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masahiro Nukui, Takao Tayama, Takeshi Kashiwagi, Masatoshi Kimura, Hidekazu Shoji