Patents by Inventor Hidekazu Sugawara

Hidekazu Sugawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor module with a plurality of semiconductor chips
    Patent number: 6060772
    Abstract: On a metal base, an insulated wiring substrate is fixed, and, on a conductive layer on the insulated wiring substrate, semiconductor chips are disposed. Above the semiconductor chips, a controlling substrate is provided, and the signals produced in this controlling substrate are supplied to electrodes on the surfaces of the semiconductor chips via bonding wires passing through openings provided in the controlling substrate.
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: May 9, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hidekazu Sugawara, Tetsujiro Tsunoda, Satoshi Nakao