Abstract: An image capturing device comprises a pixel array having a plurality of pixels each including a photoelectric conversion portion, a plurality of signal lines connected to the pixel array, a plurality of column amplifiers configured to respectively amplify signals transferred from the pixel array via the signal lines, the column amplifier comprising a first input terminal, a first output terminal, an amplifier having a second input terminal and a second output terminal, a feedback capacitance arranged between the second input terminal and the first output terminal, an input capacitance having an electrode connected to the first input terminal, and an electrode connected to the second input terminal, a first switch arranged between the second input terminal and the second output terminal, a second switch arranged between the first output terminal and the second output terminal, and a third switch arranged between a reference voltage terminal and the first output terminal.

Abstract: An image sensing apparatus comprises a pixel array; a readout unit; a first terminal; and a second terminal, wherein the readout unit including a column amplification unit, a holding unit, a first power supply line, and a second power supply line, and wherein the column amplification unit including a transistor having a gate electrode and back-gate electrode, the gate electrode receiving a signal read out from a pixel on each column of the pixel array, and the holding unit including a capacitor having a first electrode and a second electrode, the first electrode receiving a signal amplified by the column amplification unit, and wherein the first power supply line transfers the first power supply voltage to the back-gate electrode of the transistor, and the second power supply line transfers the second power supply voltage to the second electrode of the capacitor.

Abstract: An object of the present invention is to provide a structure of a thin film circuit portion and a method for manufacturing a thin film circuit portion by which an electrode for connecting to an external portion can be easily formed under a thin film circuit. A stacked body including a first insulating film, a thin film circuit formed over one surface of the first insulating film, a second insulating film formed over the thin film circuit, an electrode formed over the second insulating film, and a resin film formed over the electrode, is formed. A conductive film is formed adjacent to the other surface of the first insulating film of the stacked body to be overlapped with the electrode. The conductive film is irradiated with a laser.

Abstract: A solid-state imaging apparatus includes: a pixel region including a plurality of pixels, each including a photoelectric conversion element, arranged in matrix, and a reset switch for discharging electric charge of the photoelectric conversion element; and a first scanning circuit for supplying a reset control signal for controlling an operation of the reset switch, the pixel region and the first scanning circuit being formed on a semiconductor substrate, in which the pixel region includes a first pixel region and a second pixel region, and the first scanning circuit includes a first decoder for controlling the operation of the reset switch arranged in the first pixel region, and a second decoder for controlling the operation of the reset switch arranged in the second pixel region.

Abstract: A processing time can be defined in a system including a plurality of computers for which the processing time is calculated, by displaying candidates of paths corresponding to flow of a series of processings as to transmission and reception of each message based on transmission and reception of messages among a plurality of computers; receiving an input that selects one path among the displayed candidates; and creating a processing time in each of computers in the flow of a series of processings as to transmission and reception of messages based on the received input.

Abstract: A rotary joint of the present invention maintains cryogenic temperature of a supplying refrigerant flowing through a fluid passage, and makes available to lubricate a seal face by the supplying refrigerant as well as to minimize a running cost for the refrigerant.

Abstract: A semiconductor device in which the damage such as cracks, chinks, or dents caused by external stress is reduced is provided. In addition, the yield of a semiconductor device having a small thickness is increased. The semiconductor device includes a light-transmitting substrate having a stepped side surface, the width of which in a portion above the step and closer to one surface is smaller than that in a portion below the step, a semiconductor element layer provided over the other surface of the light-transmitting substrate, and a stack of a first light-transmitting resin layer and a second light-transmitting resin layer, which covers the one surface and part of the side surface of the light-transmitting substrate. One of the first light-transmitting resin layer and the second light-transmitting resin layer has a chromatic color.

Abstract: [PROBLEMS] To provide a compound useful as an agent for the treatment of circulatory diseases, nervous system diseases, metabolic diseases, reproductive system diseases, and digestive tract diseases. [MEANS FOR SOLVING PROBLEMS] The compound, which is for use as an active ingredient, is represented by the formula (I): [wherein R1 represents optionally halogenated C1-6 alkyl, etc.; R2 represents, e.g., a group represented by the formula (II-1) or (II-4) (wherein W represents C1-6 alkylene, etc. and R represents C1-6 alkyl, etc.); R3 represents hydrogen, C1-6 alkyl, etc.; X represents —O—, —NH—, etc.; and Y1, Y2, Y3, and Y4 each independently represents —CH—, —N—, etc.].

Abstract: Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 ?m. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 ?m. The semiconductor device is embedded in a paper in a papermaking process.

Abstract: There is provided a solid-state image pickup device comprising a plurality of pixel units, each of which includes a photoelectric conversion element, a signal line which reads out signals from said plurality of pixel units, a first capacitor element which has a first electrode connected to the signal line, an amplifier which has an input terminal connected to a second electrode of the first capacitor element, and a second capacitor element connected between the input terminal and an output terminal of the amplifier, wherein the first capacitor element has a capacitance value which is smaller at the time of execution of an adding mode than at the time of execution of a non-adding mode, and thereby making an amplification factor of the amplifier smaller at the time of execution of the adding mode than at the time of execution of the non-adding mode.

Abstract: A solid-state image pickup device wherein, in order to obtain an output of large amplitude from a low-contrast object without using a bottom detecting circuit to thereby increase a capturing rate, an accumulation end is determined when a maximum value signal in a photosensor array reaches a predetermined accumulation end level, and an amplifier circuit unit is provided for amplifying a signal, which is outputted from each of the pixels of the photosensor array, with reference to the maximum value signal of the photosensor array and for outputting the signal.

Abstract: Provided is a communication connection device that, if receiving an incoming call in which a representative telephone number that represents a group of mobile telephones is dialed, ensures that one of users of the mobile telephones answers the incoming call for sure.

Abstract: A mechanical seal having a seal cover capable of being installed on the outer surface around the circumferential surface of a hole of a seal housing and having an inner circumferential surface surrounding a shaft; a bellows having a first installation portion and a second installation portion, the first installation portion being formed by sealingly fitting the inner circumferential surface of the seal cover to one end circumferential surface of the bellows, the seconds installation portion being at the other end circumferential surface of the bellows, the first installation portion and the second installation portion forming a tubular portion between the portions, the tubular portion being formed as an elastic means surrounding the shaft; a stationary sealing ring sealingly installed on the circumferential surface of the second installation/portion and having an annular sealing surface pressed by the elastic means of the bellows; a rotating sealing ring having an annular relative sealing surface facing the s

Abstract: An object is to reduce the breakage of appearance such as a crack, a split and a chip by external stress of a semiconductor device. Another object is that manufacturing yield of a thin semiconductor device increases. The semiconductor device includes a plurality of semiconductor integrated circuits mounted on the interposer. Each of the plurality of semiconductor integrated circuits includes a light transmitting substrate which have a step on the side surface and in which the width of one section of the light transmitting substrate is narrower than that of the other section of the light transmitting substrate when the light transmitting substrate is divided at a plane including the step, a semiconductor element layer including a photoelectric conversion element provided on one surface of the light transmitting substrate, and a chromatic color light transmitting resin layer which covers the other surface of the light transmitting substrate and a part of the side surface.

Abstract: A solid-state imaging apparatus which can photograph a high-definition image and, at high quality, a moving image having lower resolution than that of the high-definition image is provided. The solid-state imaging apparatus comprises: plural pixels which include a photoelectric conversion unit and a transfer unit; an impurity diffused region which accumulates charges transferred from the photoelectric conversion unit through the transfer unit; an amplifying unit which outputs signals based on the charges accumulated by the impurity diffused region; and a reset unit which resets potential of the impurity diffused region, wherein the four pixels including the obliquely adjacent two pixels and the two pixels, in a same row or column, adjacent to one of the obliquely adjacent two pixels constitute a unit pixel group, and the impurity diffused region, the amplifying unit and the reset unit are commonly connected to the four pixels constituting the unit pixel group.

Abstract: A linkage support system links related messages among a plurality of messages sent and received among a plurality of communication terminals. The linkage support system includes an information acquisition unit that acquires message types of the plurality of messages, character strings included in the plurality of messages, and amount of data flow when the character strings are transferred. An unnecessary character strings exclusion unit that excludes character strings that are not required as keywords for linkage processing, based on the information acquired by the information acquisition unit, and a processing order determination unit determines order for using a plurality of character strings from which unnecessary character strings are excluded by the unnecessary character strings exclusion unit.

Abstract: A solid-state imaging apparatus includes: a pixel region including a plurality of pixels, each including a photoelectric conversion element, arranged in matrix, and a reset switch for discharging electric charge of the photoelectric conversion element; and a first scanning circuit for supplying a reset control signal for controlling an operation of the reset switch, the pixel region and the first scanning circuit being formed on a semiconductor substrate, in which the pixel region includes a first pixel region and a second pixel region, and the first scanning circuit includes a first decoder for controlling the operation of the reset switch arranged in the first pixel region, and a second decoder for controlling the operation of the reset switch arranged in the second pixel region.

Abstract: A mechanical seal device comprises an attachment component (30) made of resin material having a mounting face (30A) attached with an outer face (60A) of a casing body (60), a fitting face (30C), a ring shape groove face (30B) and a shutoff face (30S) which are formed on an inner circumferential face, and a cooling fluid passage (40) communicating with a cooling chamber (R3) in said ring shape groove face (30B). The mechanical seal device further comprises a first seal ring (3) made of a rustless material having a seal face (3A), a second seal ring (10) made of a rustless material having a counter seal face (10A) slidable in closely contact with the seal face (3A), a seal collar (50) made of resin material holding said second seal ring (10) hermetically, and a seal ring (20) having a third seal face (20B1) which closely contacts with said shutoff face (30S). The seal ring (20) is sandwiched between said supporting circumferential face (50A) and a circumferential section (10B) of the second seal ring (10).

Abstract: A photoelectric conversion device includes a first electrode; and, over the first electrode, photoelectric conversion layer that includes a first semiconductor layer having one conductivity, a second semiconductor layer over the first semiconductor layer, and a third semiconductor layer having a conductivity opposite to the one conductivity of the second semiconductor layer. An insulating layer is over the third semiconductor layer, and a second electrode is over the insulating layer and is electrically connected to the third semiconductor layer through the insulating layer. The third semiconductor layer and a part of the second semiconductor layer are removed in a region of the photoelectric conversion layer that does not overlap the insulating layer.

Abstract: A portable telephone and electronic device are provided. The portable telephone includes a casing having a first surface: a finger guide section that is provided in the first surface and guides a finger of a user to allow the finger to be placed so that a side portion of the finger faces the first surface; an illuminating section provided in the first surface so as to be adjacent to the finger guide section, the illuminating section being capable of radiating light of a predetermined wavelength that transmits through the placed finger; an imaging section provided in the casing so as to be spaced at a predetermined distance from the first surface with respect to a perpendicular direction, the imaging section being capable of imaging the light that has transmitted through the finger; and a control section that performs authentication of the user on the basis of an image obtained by the imaging.