Patents by Inventor Hidekazu Yagi

Hidekazu Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110244999
    Abstract: A continuously variable chain-belt transmission (chain-belt CVT) housed in a transmission casing formed by a transmission case and a side cover, has a pair of conical disk pairs, each pair of which is rotatably supported by disk supporting portions provided in the transmission case and the side cover; a chain wound around the pair of conical disk pairs; a chain guide attached to the chain to restrain movement of the chain and having an annular guide portion that encloses an entire circumference, in cross section, of the chain; and a chain guide supporting portion supporting the chain guide between the transmission case and the side cover. The chain guide supporting portion has a fixing side chain guide supporting portion fixed to the transmission case and a connecting side chain guide supporting portion connecting to the fixing side chain guide supporting portion.
    Type: Application
    Filed: February 9, 2011
    Publication date: October 6, 2011
    Inventors: Takayuki NAKAMURA, Hidekazu YAGI, Kazutaka IMAI
  • Patent number: 6673858
    Abstract: A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, contains a thermosetting resin and an insulating inorganic filler, wherein the insulating inorganic filler content (a; vol %) and the elastic modulus of the thermosetting adhesive material after curing (E; GPa/30° C.) satisfy the following relational formula (1): 0.042a+0.9<E<0.106a+2.5  (1) and at the same time, the insulating inorganic filler content (a; vol %) and the tensile elongation (d; %) at 25° C. of the thermosetting adhesive material after curing satisfy the following relational formula (2) −0.072a+4<d<−0.263a+13  (2).
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: January 6, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Motohide Takeichi, Hidekazu Yagi
  • Patent number: 6566422
    Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: May 20, 2003
    Assignee: Sony Chemicals Corporation
    Inventors: Hidekazu Yagi, Motohide Takeichi, Junji Shinozaki
  • Patent number: 6514433
    Abstract: A connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements and in building up electroconductive connection between the corresponding electrodes and can provide mechanical bonding and electrical connection effectively even when bonding an element of a polyimide resin film with a counter element, without the occurrence of a reduction in the reliability of the electrical conductance, even in services under a high temperature and high humidity. The connecting material contains an adhesive component containing a thermosetting resin and has, after having been cured, characteristic features of a modulus of elasticity at 30° C. in the range of 0.9-3 Gpa, a glass transition temperature of at the lowest 100° C. and a tensile elongation percentage of at least 3%.
    Type: Grant
    Filed: September 11, 2000
    Date of Patent: February 4, 2003
    Assignee: Sony Chemicals Corporation
    Inventors: Motohide Takeichi, Hidekazu Yagi, Kaori Suemasa
  • Publication number: 20010020697
    Abstract: A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, contains a thermosetting resin and an insulating inorganic filler,
    Type: Application
    Filed: December 4, 2000
    Publication date: September 13, 2001
    Applicant: Sony Chemical Corp.
    Inventors: Motohide Takeichi, Hidekazu Yagi
  • Patent number: D509591
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: September 13, 2005
    Assignee: Omron Healthcare Co., Ltd.
    Inventors: Shigeru Tomioka, Takashi Inagaki, Tadashi Koike, So Noguchi, Hidekazu Yagi
  • Patent number: D515700
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: February 21, 2006
    Assignee: Omron Heatlhcare Co., Ltd.
    Inventors: Kenji Eda, Hiroya Nakanishi, Hiroshi Kishimoto, Shingo Yamashita, So Noguchi, Hidekazu Yagi, Masashi Fukura, Tetsuya Nakada
  • Patent number: D524444
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: July 4, 2006
    Assignee: Omron Healthcare Co., Ltd.
    Inventors: Shigeru Tomioka, Takashi Inagaki, Tadashi Koike, So Noguchi, Hidekazu Yagi
  • Patent number: D608313
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: January 19, 2010
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D623196
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: September 7, 2010
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D626568
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: November 2, 2010
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D628979
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: December 14, 2010
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D638032
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: May 17, 2011
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D648336
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: November 8, 2011
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D654507
    Type: Grant
    Filed: January 3, 2011
    Date of Patent: February 21, 2012
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D654932
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: February 28, 2012
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D655690
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: March 13, 2012
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D669872
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: October 30, 2012
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D681605
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: May 7, 2013
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi
  • Patent number: D707715
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hidekazu Yagi