Patents by Inventor Hideki Eguchi
Hideki Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9621622Abstract: An information providing apparatus according to an embodiment of the invention includes a receiving unit and a distribution unit. The receiving unit receives an access request for accessing first content from a terminal apparatus used by a first user. The distribution unit distributes, to the terminal apparatus, the first content including link information which is posted by a second user related to the first user in a predetermined communication service among pieces of link information to other content when the receiving unit receives the access request.Type: GrantFiled: August 7, 2013Date of Patent: April 11, 2017Assignee: YAHOO JAPAN CORPORATIONInventors: Yuji Ueda, Yusuke Fujiki, Hideki Eguchi, Yusuke Kondo, Kenichirou Yamaguchi, Mariko Fujita
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Publication number: 20140173031Abstract: An information providing apparatus according to an embodiment of the invention includes a receiving unit and a distribution unit. The receiving unit receives an access request for accessing first content from a terminal apparatus used by a first user. The distribution unit distributes, to the terminal apparatus, the first content including link information which is posted by a second user related to the first user in a predetermined communication service among pieces of link information to other content when the receiving unit receives the access request.Type: ApplicationFiled: August 7, 2013Publication date: June 19, 2014Applicant: YAHOO JAPAN CORPORATIONInventors: Yuji Ueda, Yusuke Fujiki, Hideki Eguchi, Yusuke Kondo, Kenichirou Yamaguchi, Mariko Fujita
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Patent number: 6887581Abstract: The present invention provides a laminate for automobile parts having a layer A made from a polyamide resin composition containing 70-99 wt % of (a) a specific polyamide polymer, and 1-30 wt % of (b-1) an ethylene copolymer containing an epoxy group and/or (b-2) an ethylene copolymer modified by an acid anhydride, and a layer B made from a resin composition containing (c-1) a polyethylene resin modified by an acid anhydride and/or (c-2) a polyethylene resin containing an epoxy group, wherein the layer A and the layer B are heat-sealed, except when (1) the layer A contains (b-1) alone as the ethylene copolymer and the layer B contains (c-2) alone as the polyethylene resin; and when (2) the layer A contains (b-2) alone as the ethylene copolymer and the layer B contains (c-1) alone as the polyethylene resin. The laminate of the present invention is superior in strength, stiffness and gasoline barrier property that the automobile parts are required to have.Type: GrantFiled: April 26, 2002Date of Patent: May 3, 2005Assignees: Toyo Boseki Kabushiki Kaisha, Toyoda Gosei Co., Ltd.Inventors: Tsutomu Tamura, Hideki Eguchi, Junji Koizumi, Satoru Watanabe
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Patent number: 6835771Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: GrantFiled: January 22, 2003Date of Patent: December 28, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Patent number: 6835787Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: GrantFiled: January 22, 2003Date of Patent: December 28, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Publication number: 20030125481Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: ApplicationFiled: January 22, 2003Publication date: July 3, 2003Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Publication number: 20030125440Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: ApplicationFiled: January 22, 2003Publication date: July 3, 2003Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Patent number: 6534583Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: GrantFiled: September 28, 2000Date of Patent: March 18, 2003Assignee: Toyo Boseki Kabushiki KaishaInventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Publication number: 20020197495Abstract: The present invention provides a laminate for automobile parts having a layer A made from a polyamide resin composition containing 70-99 wt % of (a) a specific polyamide polymer, and 1-30 wt % of (b-1) an ethylene copolymer containing an epoxy group and/or (b-2) an ethylene copolymer modified by an acid anhydride, and a layer B made from a resin composition containing (c-1) a polyethylene resin modified by an acid anhydride and/or (c-2) a polyethylene resin containing an epoxy group, wherein the layer A and the layer B are heat-sealed, except when (1) the layer A contains (b-1) alone as the ethylene copolymer and the layer B contains (c-2) alone as the polyethylene resin; and when (2) the layer A contains (b-2) alone as the ethylene copolymer and the layer B contains (c-1) alone as the polyethylene resin. The laminate of the present invention is superior in strength, stiffness and gasoline barrier property that the automobile parts are required to have.Type: ApplicationFiled: April 26, 2002Publication date: December 26, 2002Inventors: Tsutomu Tamura, Hideki Eguchi, Junji Koizumi, Satoru Watanabe