Patents by Inventor Hideki Eguchi

Hideki Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9621622
    Abstract: An information providing apparatus according to an embodiment of the invention includes a receiving unit and a distribution unit. The receiving unit receives an access request for accessing first content from a terminal apparatus used by a first user. The distribution unit distributes, to the terminal apparatus, the first content including link information which is posted by a second user related to the first user in a predetermined communication service among pieces of link information to other content when the receiving unit receives the access request.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: April 11, 2017
    Assignee: YAHOO JAPAN CORPORATION
    Inventors: Yuji Ueda, Yusuke Fujiki, Hideki Eguchi, Yusuke Kondo, Kenichirou Yamaguchi, Mariko Fujita
  • Publication number: 20140173031
    Abstract: An information providing apparatus according to an embodiment of the invention includes a receiving unit and a distribution unit. The receiving unit receives an access request for accessing first content from a terminal apparatus used by a first user. The distribution unit distributes, to the terminal apparatus, the first content including link information which is posted by a second user related to the first user in a predetermined communication service among pieces of link information to other content when the receiving unit receives the access request.
    Type: Application
    Filed: August 7, 2013
    Publication date: June 19, 2014
    Applicant: YAHOO JAPAN CORPORATION
    Inventors: Yuji Ueda, Yusuke Fujiki, Hideki Eguchi, Yusuke Kondo, Kenichirou Yamaguchi, Mariko Fujita
  • Patent number: 6887581
    Abstract: The present invention provides a laminate for automobile parts having a layer A made from a polyamide resin composition containing 70-99 wt % of (a) a specific polyamide polymer, and 1-30 wt % of (b-1) an ethylene copolymer containing an epoxy group and/or (b-2) an ethylene copolymer modified by an acid anhydride, and a layer B made from a resin composition containing (c-1) a polyethylene resin modified by an acid anhydride and/or (c-2) a polyethylene resin containing an epoxy group, wherein the layer A and the layer B are heat-sealed, except when (1) the layer A contains (b-1) alone as the ethylene copolymer and the layer B contains (c-2) alone as the polyethylene resin; and when (2) the layer A contains (b-2) alone as the ethylene copolymer and the layer B contains (c-1) alone as the polyethylene resin. The laminate of the present invention is superior in strength, stiffness and gasoline barrier property that the automobile parts are required to have.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: May 3, 2005
    Assignees: Toyo Boseki Kabushiki Kaisha, Toyoda Gosei Co., Ltd.
    Inventors: Tsutomu Tamura, Hideki Eguchi, Junji Koizumi, Satoru Watanabe
  • Patent number: 6835771
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: December 28, 2004
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Patent number: 6835787
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: December 28, 2004
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Publication number: 20030125481
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 3, 2003
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Publication number: 20030125440
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 3, 2003
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Patent number: 6534583
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: March 18, 2003
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Publication number: 20020197495
    Abstract: The present invention provides a laminate for automobile parts having a layer A made from a polyamide resin composition containing 70-99 wt % of (a) a specific polyamide polymer, and 1-30 wt % of (b-1) an ethylene copolymer containing an epoxy group and/or (b-2) an ethylene copolymer modified by an acid anhydride, and a layer B made from a resin composition containing (c-1) a polyethylene resin modified by an acid anhydride and/or (c-2) a polyethylene resin containing an epoxy group, wherein the layer A and the layer B are heat-sealed, except when (1) the layer A contains (b-1) alone as the ethylene copolymer and the layer B contains (c-2) alone as the polyethylene resin; and when (2) the layer A contains (b-2) alone as the ethylene copolymer and the layer B contains (c-1) alone as the polyethylene resin. The laminate of the present invention is superior in strength, stiffness and gasoline barrier property that the automobile parts are required to have.
    Type: Application
    Filed: April 26, 2002
    Publication date: December 26, 2002
    Inventors: Tsutomu Tamura, Hideki Eguchi, Junji Koizumi, Satoru Watanabe