Abstract: The present invention provides an unmanned watercraft capable of sufficiently cooling equipment that generates a large amount of heat, capable of cooling such equipment without using energy in the watercraft, and capable of improving mean time between failures (MTBF) of a cooling device. An unmanned watercraft 1 has a cooling structure CS for cooling a central processing unit CPU1 for image recognition and a central processing unit CPU2 for control that constitute a central processing unit CPU as a heat-generating body. The cooling structure CS includes a waterproof container 7 that accommodates the heat-generating body (an insulating envelope that surrounds the heat-generating body in an electrically insulated state). The waterproof container 7 is arranged outside a submerged part 3 of the unmanned watercraft 1 so as to be in contact with water present outside the unmanned watercraft 1, the submerged part 3 being submerged in water.

Abstract: The present invention provides an unmanned watercraft capable of sufficiently cooling equipment that generates a large amount of heat, capable of cooling such equipment without using energy in the watercraft, and capable of improving mean time between failures (MTBF) of a cooling device. An unmanned watercraft 1 has a cooling structure CS for cooling a central processing unit CPU1 for image recognition and a central processing unit CPU2 for control that constitute a central processing unit CPU as a heat-generating body. The cooling structure CS includes a waterproof container 7 that accommodates the heat-generating body (an insulating envelope that surrounds the heat-generating body in an electrically insulated state). The waterproof container 7 is arranged outside a submerged part 3 of the unmanned watercraft 1 so as to be in contact with water present outside the unmanned watercraft 1, the submerged part 3 being submerged in water.

Abstract: A facility maintenance method updates, in a case where an event having occurred in a facility is determined to fall outside a fault tree, the fault tree such that a cause of occurrence of the event identified through investigation is reflected, and in response to the identified cause of occurrence of the event, identifies a location where a structural element of equipment/material identified to relate to the cause of occurrence of the event is used, based on installation information indicating a location where the equipment/material is installed, to formulate an inspection plan for the identified location.

Abstract: A glass powder having an average particle size of at least 0.5 ?m and smaller than 5.0 ?m, having a specific surface area of at least 1.5 m2/cm3, and having a glass transition temperature higher than 200° C. and lower than 400° C.

Abstract: A controlling method for controlling an image forming apparatus has a step of displaying a printing paper illustration representing printing paper on an operating screen and a step of displaying at least one icon related to a process function of the image forming apparatus. The controlling method further has a step of selecting a process function that corresponds to the specified icon and a step of determining the location to which the selected process function is applied upon receiving an instruction for a position on the printing paper illustration.

Abstract: Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to heat cycles during joining or in an environment of use, and that has high heat conductivity and cost effectiveness. The heat dissipating plate (4) uses a copper-base alloy having a 0.2% yield strength of at least 300 N/mm2 which is characterized in that the 0.2% yield strength after heating at 400° C. for 10 minutes is at least 90% of the 0.2% yield strength before heating and that said copper-base alloy has a heat conductivity of at least 350 W/m·K and contains at least one element of the group consisting of Fe, Co and Ni plus P in a total amount of 0.01–0.3%; the heat dissipating plate (4) is 10–200 mm long on each side, 0.

Abstract: A controlling method for controlling an image forming apparatus has a step of displaying a prinnting paper illustration representing printing paper on an operating screen and a step of displaying at least one icon related to a process function of the image forming apparatus. The controlling method further has a step of selecting a process function that corresponds to the specified icon and a step of determining the location to which the selected process function is applied upon receiving an instruction for a position on the printing paper illustration.

Abstract: A thermoplastic resin composition comprising a thermoplastic resin containing no halogen atom, from 0.1 to 50 parts by mass, per 100 parts by mass of said thermoplastic resin, of a phosphate type glass, and from 0.1 to 50 parts by mass, per 100 parts by mass of said thermoplastic resin, of a phosphorus type flame retardant other than the above phosphate type glass.

Abstract: A glass powder having an average particle size of at least 0.5 ?m and smaller than 5.0 ?m, having a specific surface area of at least 1.5 m2/cm3, and having a glass transition temperature higher than 200° C. and lower than 400° C.

Abstract: A complex flame retardant having a phosphate type glass and a phosphorus type flame retardant other than the phosphate type glass complexed, wherein the blend proportions of the phosphate type glass and the phosphorus type flame retardant are such that the phosphorus type flame retardant is within a range of from 2 to 240 parts by mass per 100 parts by mass of the phosphate type glass.

Abstract: Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to heat cycles during joining or in an environment of use, and that has high heat conductivity and cost effectiveness.

Abstract: Chopped strands having a sizing agent impregnated on glass fiber strands, to be used for a molded product of unsaturated polyester resin BMC, wherein the sizing agent comprises a urethane resin, a vinyl acetate resin and a silane coupling agent, and wherein the mass ratio of the urethane resin to the vinyl acetate resin is from 30:70 to 70:30.

Abstract: A thermoplastic resin composition comprising a thermoplastic resin containing no halogen atom, from 0.1 to 50 parts by mass, per 100 parts by mass of said thermoplastic resin, of a phosphate type glass, and from 0.1 to 50 parts by mass, per 100 parts by mass of said thermoplastic resin, of a phosphorus type flame retardant other than the above phosphate type glass.

Abstract: Chopped strands having a sizing agent impregnated to glass fiber strands, to be used for a molded product of unsaturated polyester resin BMC, wherein the sizing agent comprises a urethane resin, a vinyl acetate resin and a silane coupling agent, and wherein the mass ratio of the urethane resin to the vinyl acetate resin is from 30:70 to 70:30.