Patents by Inventor Hideki Eriguchi

Hideki Eriguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition for metal-clad laminates
    Patent number: 5066691
    Abstract: An adhesive composition for metal-clad laminates which comprises:(a) 100 parts by weight of a polyvinylbutyral having an average polymerization degree of from 500 to 3,000 and a degree of butyralization of at least 60 mol %,(b) from 10 to 200 parts by weight of an epoxidized polybutadiene per 100 parts by weight of the polyvinylbutyral, the epoxidized polybutadiene having a number average molecular weight of from 1,000 to 10,000 and an epoxy equivalent weight of from 200 to 2,000, and(c) from 1 to 10 parts by weight of a hardener for the epoxidized polybutadiene per 100 parts by weight of the epoxidized polybutadiene.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: November 19, 1991
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Toshihisa Kumakura, Ken Nanaumi, Ryoichi Ikezawa, Hideki Eriguchi