Abstract: Provided is a copper powder manufactured by means of a wet method, wherein the absolute value of the zeta potential of the copper powder is at least 20 mV. The copper powder can be manufactured so as to reduce the burden of the steps of crushing a dry cake and classification, and there is a sufficient reduction in residual secondary particles.

Abstract: There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 ?g with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500° C. or higher.

Abstract: There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 ?g with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500° C. or higher.

Abstract: Provided is a copper powder manufactured by means of a wet method, wherein the absolute value of the zeta potential of the copper powder is at least 20 mV. The copper powder can be manufactured so as to reduce the burden of the steps of crushing a dry cake and classification, and there is a sufficient reduction in residual secondary particles.

Abstract: Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a non-metal layer, wherein the copper powder paste sintered body has a crystal grain diameter of copper of 10 ?m or less, as determined from an EBSD map image, based on Area Fraction method, and has an average reliability index (CI value) of 0.5 or more in an analysis area.

Abstract: Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a ceramic layer, the laminate comprising portions where one or more elements selected from Si, Ti and Zr derived from a copper powder surface treatment agent are together present with a thickness in a range of from 5 to 15 nm in boundaries between the copper powder paste sintered body and the ceramic layer, when observing the boundaries by scanning the laminate with STEM over 100 nm across the boundaries in a thickness direction of the laminate.

Abstract: Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a ceramic layer, the laminate comprising portions where one or more elements selected from Si, Ti and Zr derived from a copper powder surface treatment agent are together present with a thickness in a range of from 5 to 15 nm in boundaries between the copper powder paste sintered body and the ceramic layer, when observing the boundaries by scanning the laminate with STEM over 100 nm across the boundaries in a thickness direction of the laminate.

Abstract: Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a non-metal layer, wherein the copper powder paste sintered body has a crystal grain diameter of copper of 10 ?m or less, as determined from an EBSD map image, based on Area Fraction method, and has an average reliability index (CI value) of 0.5 or more in an analysis area.

Abstract: A surface treatment metal powder having any of the following characteristics is provided as a metal powder that can be suitably used for metal AM and has excellent laser absorbing characteristics: the brightness L* of the surface is 0-50; the color difference ?Eab of the surface is 40 or more; the color difference ?L of the surface is ?35 or less; the color difference ?a of the surface is 20 or less; and the color difference ?b of the surface is 20 or less (when determined on the basis of the object color of a white plate (brightness L*=94.14, color coordinate a*=?0.90, color coordinate b*=0.24)).

Abstract: A method for producing a surface-treated metal powder, which comprises: a step for preparing a metal powder dispersion liquid by mixing a metal powder with an aqueous solution of a coupling agent having an amino group; a step for recovering, as a residue, the metal powder from the metal powder dispersion liquid; and a step for cleaning the metal powder, which has been re-covered as a residue, with use of an aqueous solvent. This method for producing a surface-treated metal powder provides a method for producing a surface-treated copper powder or metal powder which has excellent sintering delaying properties and is suitable for use in the production of an electrode for multilayer ceramic chip capacitors.

Abstract: Provided are a surface-treated copper powder and a metal powder that exhibit superior sinter delay properties and are suitable for use in the manufacture of electrodes for multilayer ceramic capacitor chips. The surface-treated metal powder has an N (nitrogen) content of at least 0.02 wt % relative to the surface-treated metal powder, and satisfies the formulas 50?x?1500 and y?0.2x+600, in which x is the coating mass per 1 g of metal powder of one element selected from the group consisting of Al, Si, Ti, Zr, Ce, and Sn, and in which y (° C.) is the starting temperature of sintering. Also provided is a method for producing the powders.

Abstract: A mat member includes an inorganic fiber, an organic binder, and a material which expands at a temperature of approximately 130° C. to approximately 200° C.

Abstract: A mat member includes an inorganic fiber, an organic binder, and a material which expands at a temperature of approximately 130° C. to approximately 200° C.