Patents by Inventor Hideki GOCHO

Hideki GOCHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRESSURE SENSOR AND PRESSURE SENSOR MODULE
    Publication number: 20190162615
    Abstract: A pressure sensor according to the present invention includes a first detection unit that is disposed in a first region and that detects an absolute value of a pressure of a first medium, a second detection unit that is disposed in a second region separated from the first region and that detects an absolute value of a pressure of a second medium that differs from the first medium, and a calculation unit that performs a calculation to obtain a difference between a first pressure detected by the first detection unit and a second pressure detected by the second detection unit.
    Type: Application
    Filed: January 29, 2019
    Publication date: May 30, 2019
    Inventors: Hisanobu OKAWA, Chiaki KERA, Hideki GOCHO, Kazushige SEJIMO
  • Electronic component and method of manufacturing the same
    Patent number: 9559030
    Abstract: An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: January 31, 2017
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Hideki Gocho, Shuji Yanagi, Masaya Yamatani, Hisayuki Yazawa
  • ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160284621
    Abstract: An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.
    Type: Application
    Filed: March 14, 2016
    Publication date: September 29, 2016
    Inventors: Hideki GOCHO, Shuji YANAGI, Masaya YAMATANI, Hisayuki YAZAWA