Patents by Inventor Hideki Hamamoto

Hideki Hamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and an apparatus for packing a semisolid compound in bags
    Patent number: 4627224
    Abstract: A method of packing a semisolid compound into a bag comprising the steps of precooling a high temperature semisolid compound to such a temperature at which it can maintain the desired viscosity, filling said precooled semisolid compound into a packing bag made of synthetic resin while cooling its outer surface with water, heat-sealing an opening part of the bag, putting the bag in a water tank for cooling, removing the cooled bag and transporting it, and an apparatus for carrying out the above-described method.
    Type: Grant
    Filed: July 6, 1984
    Date of Patent: December 9, 1986
    Assignees: Nihon Spindle Seizo Kabushiki Kaisha, Showa Rekisei Kogyo Kabushiki Kaisha
    Inventors: Hideki Hamamoto, Tsutomu Fujita, Takuzo Mori