Patents by Inventor Hideki Hanabusa

Hideki Hanabusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230279219
    Abstract: An epoxy resin composition is provided that has an elastic modulus, deformability, fracture toughness, and heat resistance in good balance. A prepreg produced from the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg are also provided, where the epoxy resin composition includes the components [A], [B], and [C] and satisfies all of the requirements (1), (2), and (3) as described.
    Type: Application
    Filed: August 6, 2021
    Publication date: September 7, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Yuichi Yamakita, Daisuke Konishi, Hideki Hanabusa, Noriyuki Hirano, Reo Takaiwa
  • Publication number: 20220177696
    Abstract: The purpose of the present invention is to provide an epoxy resin composition which exhibits a high level of deforming capacity and fracture toughness and from which a resin cured product maintaining heat resistance can be obtained. The epoxy resin composition according to the present invention satisfies condition 1 or condition 2 below, wherein the resin cured product obtained by reacting the epoxy resin composition at 150° C. for 60 minutes has a tensile elongation at break of 7% or more. Condition 1: including all the following components [A], [B], and [C], component [A]: a bifunctional aliphatic epoxy resin having a specific structure, component [B]: a terminal carboxy-modified acrylic rubber, and component [C]: a dicyandiamide.
    Type: Application
    Filed: April 1, 2020
    Publication date: June 9, 2022
    Applicant: Toray Industries, Inc.
    Inventors: Daisuke Konishi, Yuichi Yamakita, Hideki Hanabusa, Noriyuki Hirano, Masahiro Tsuzuki