Patents by Inventor Hideki Haneda

Hideki Haneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7266139
    Abstract: A semiconductor laser diode optically coupled to an optical fiber is mounted on a stem. A cap having a light transmissive hole between the optical fiber and the semiconductor laser diode is fixed to the stem. A ball lens is fixed in the light transmissive hole. The ball lens has a refractive index of 1.9 or more and a diameter between 1.5 mm and 2.5 mm.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: September 4, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Haneda, Seiichiro Tabata, Atsushi Kawamura
  • Patent number: 7023891
    Abstract: A semiconductor optical device which has a ridge structure includes a waveguide area between paired mesa trenches; first and second mount areas disposed outside the mesa trenches; a first spacer layer disposed in a first mount area and a second spacer layer disposed in a second mount area; a first metal layer electrically connected to an upper cladding layer in the waveguide area and extending from the waveguide area over the first mount area; and a second metal layer disposed over the second mount area. Thicknesses from a back surface of the semiconductor optical device to the first metal layer in the first mount area and to the second metal layer in the second mount area are both larger than thickness from the back surface to the first metal layer in the waveguide area.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: April 4, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Haneda, Go Sakaino, Yoshihiro Hisa
  • Publication number: 20050286592
    Abstract: A semiconductor laser array device for outputting a higher power includes: a plurality of semiconductor laser chips, arranged in a predetermined pitch; a submount for mounting each semiconductor laser chip; and a heat sink for dissipating heat from the semiconductor laser chip through the submount; wherein a distance S between the centers of the chips and a thickness T of the submount satisfy the following inequality: 2×T?S?10×T, whereby improving efficiency of heat dissipation with a good process yield.
    Type: Application
    Filed: March 14, 2005
    Publication date: December 29, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Naoyuki Shimada, Kimio Shigihara, Kazushige Kawasaki, Kimitaka Shibata, Tetsuya Yagi, Kenichi Ono, Hideki Haneda
  • Publication number: 20050276304
    Abstract: A semiconductor laser diode optically coupled to an optical fiber, is mounted on a stem. A cap having a light transmissive hole between the optical fiber and the semiconductor laser diode is fixed to the stem. A ball lens is fixed in the light transmissive hole. The ball lens has a refractive index of 1.9 or more and a diameter between 1.5 mm and 2.5 mm.
    Type: Application
    Filed: May 3, 2005
    Publication date: December 15, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Haneda, Seiichiro Tabata, Atsushi Kawamura
  • Publication number: 20030210721
    Abstract: A semiconductor optical device which has a ridge structure comprises: a waveguide area which is between paired mesa trenches; first and second mount areas disposed outside the mesa trenches; a first spacer layer disposed in the first mount area and a second spacer layer disposed in the second mount area; a first metal layer which is electrically connected to the upper cladding layer in the waveguide area and which expands from the waveguide area over the first mount area; and a second metal layer which is disposed over the second mount area. The height from the back surface to the first metal layer in the first mount area and the height from the back surface to the second metal layer in the second mount area are both higher than the height from the back surface to the first metal layer in the waveguide area.
    Type: Application
    Filed: May 2, 2003
    Publication date: November 13, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Haneda, Go Sakaino, Yoshihiro Hisa