Patents by Inventor Hideki Hijikata

Hideki Hijikata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7989099
    Abstract: An information medium substrate is formed as a flat plate and includes a first convex part formed on one surface of the information medium substrate in a region between a rim part of a center hole and an inner circumferential edge of an information region and a second convex part formed on another surface of the information medium substrate at a position that overlaps a protruding end part of the first convex part in a thickness direction of the information medium substrate.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: August 2, 2011
    Assignee: TDK Corporation
    Inventors: Atsushi Koyama, Teppei Osawa, Tomoki Ushida, Kentaro Iida, Mamoru Usami, Hideki Hijikata
  • Publication number: 20070274195
    Abstract: An information medium substrate is formed as a flat plate and includes a first convex part formed on one surface of the information medium substrate in a region between a rim part of a center hole and an inner circumferential edge of an information region and a second convex part formed on another surface of the information medium substrate at a position that overlaps a protruding end part of the first convex part in a thickness direction of the information medium substrate.
    Type: Application
    Filed: May 25, 2007
    Publication date: November 29, 2007
    Applicant: TDK CORPORATION
    Inventors: Atsushi KOYAMA, Teppei OSAWA, Tomoki USHIDA, Kentaro IIDA, Mamoru USAMI, Hideki HIJIKATA