Patents by Inventor Hideki HOSADA

Hideki HOSADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Superelastic alloy
    Patent number: 10590519
    Abstract: The present invention provides a superelastic alloy formed by addition of Fe or Co to an Au—Cu—Al alloy, including: Cu of 12.5% by mass or more and 16.5% by mass or less; Al of 3.0% by mass or more and 5.5% by mass or less; Fe or Co of 0.01% by mass or more and 2.0% by mass or less; and a balance Au, and a difference between Al content and Cu content (Cu—Al) is 12% by mass or less. The superelastic alloy according to the present invention has superelastic property while being Ni-free, excellent X-ray imaging property, processability, and strength property, and is suitable for a medical field.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: March 17, 2020
    Assignees: TANAKA KIKINZOKU KOGYO K.K., TOKYO INSTITUTE OF TECHNOLOGY
    Inventors: Hideki Hosada, Tomonari Inamura, Masaki Tahara, Tomohiko Morita, Akira Umise, Yusuke Doi, Kenji Goto
  • SUPERELASTIC ALLOY
    Publication number: 20160362772
    Abstract: The present invention provides a superelastic alloy formed by addition of Fe or Co to an Au—Cu—Al alloy, including: Cu of 12.5% by mass or more and 16.5% by mass or less; Al of 3.0% by mass or more and 5.5% by mass or less; Fe or Co of 0.01% by mass or more and 2.0% by mass or less; and a balance Au, and a difference between Al content and Cu content (Cu—Al) is 12% by mass or less. The superelastic alloy according to the present invention has superelastic property while being Ni-free, excellent X-ray imaging property, processability, and strength property, and is suitable for a medical field.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 15, 2016
    Inventors: Hideki HOSADA, Tomonari INAMURA, Masaki TAHARA, Tomohiko MORITA, Akira UMISE, Yusuke DOI, Kenji GOTO