Patents by Inventor Hideki Hukunaga

Hideki Hukunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for semiconductor device
    Patent number: 5903048
    Abstract: A lead frame including a holding portion having an area smaller than a semiconductor element to be mounted on the holding portion; and a suspension lead extending outward from the holding portion, from opposite sides of the holding portion, for supporting the holding portion.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: May 11, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kouji Bandou, Akiyoshi Sawai, Hideki Hukunaga