Abstract: An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising: acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot; and derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information.

Abstract: A photoelectric converting device including: a semiconductor layer with a front surface and a back surface, the semiconductor layer including a photoelectric conversion portion; a wire structure including an insulating film, the wire structure being disposed on the front surface of the semiconductor layer; a first insulator portion disposed in a trench provided in the semiconductor layer; and a second insulator portion disposed between the first insulator portion and the insulating film, wherein the first insulator portion has a maximum width larger than a maximum width of the second insulator portion.

Abstract: A method of manufacturing a semiconductor device by using an exposure apparatus having a reticle stage and a projection optical system includes a first period in which substrates are exposed by using a first reticle arranged on the reticle stage, a second period in which substrates are exposed by using a second reticle arranged on the reticle stage, and a third period which is between the first and second periods. The method includes changing, in at least part of the third period, the first reticle arranged on the reticle stage to the second reticle, and performing control, in the first and second periods, to adjust temperature distribution of an optical element of the projection optical system so as to reduce change in aberration of the projection optical system. The third period is shorter than the first period.

Abstract: A curved surface constituting a convex surface or a concave surface of each of a plurality of lenses includes at least a silicon nitride layer and another silicon nitride layer. An interlayer having a composition different from a composition of the silicon nitride layer and a composition of the other silicon nitride layer is arranged between the silicon nitride layer and the other silicon nitride layer, and a thickness of the interlayer is less than a thickness of the silicon nitride layer and a thickness of the other silicon nitride layer.

Abstract: A color filter array is provided. The array comprises a first color filter, a second color filter, and a third color filter that are arranged on a base member and respectively have different colors. The first color filter and the third color filter are arranged adjacent to each other, the second color filter includes a portion placed between an end portion of the third color filter and the base member, and the end portion of the third color filter and the portion of the second color filter are in contact with the first color filter.

Abstract: A method of manufacturing a semiconductor device by using an exposure apparatus having a reticle stage and a projection optical system includes a first period in which substrates are exposed by using a first reticle arranged on the reticle stage, a second period in which substrates are exposed by using a second reticle arranged on the reticle stage, and a third period which is between the first and second periods. The method includes changing, in at least part of the third period, the first reticle arranged on the reticle stage to the second reticle, and performing control, in the first and second periods, to adjust temperature distribution of an optical element of the projection optical system so as to reduce change in aberration of the projection optical system. The third period is shorter than the first period.

Abstract: An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising: acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot; and derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information.

Abstract: A curved surface constituting a convex surface or a concave surface of each of a plurality of lenses includes at least a silicon nitride layer and another silicon nitride layer. An interlayer having a composition different from a composition of the silicon nitride layer and a composition of the other silicon nitride layer is arranged between the silicon nitride layer and the other silicon nitride layer, and a thickness of the interlayer is less than a thickness of the silicon nitride layer and a thickness of the other silicon nitride layer.

Abstract: A photoelectric converting device including: a semiconductor layer with a front surface and a back surface, the semiconductor layer including a photoelectric conversion portion; a wire structure including an insulating film, the wire structure being disposed on the front surface of the semiconductor layer; a first insulator portion disposed in a trench provided in the semiconductor layer; and a second insulator portion disposed between the first insulator portion and the insulating film, wherein the first insulator portion has a maximum width larger than a maximum width of the second insulator portion.

Abstract: A photoelectric conversion device includes a waveguide member disposed above a photoelectric conversion unit, and an insulating member disposed above a substrate, and surrounding at least part of the waveguide member. The waveguide member has a first side face, a second side face, and a third side face, arranged in that order from the substrate. An angle of inclination of the first side face is smaller than an angle of inclination of the second side face. An angle of inclination of the third side face is smaller than the angle of inclination of the second side face. The angle of inclination of the second side face is smaller than 90 degrees.

Abstract: A photoelectric conversion device includes a waveguide member disposed above a photoelectric conversion unit, and an insulating member disposed above a substrate, and surrounding at least part of the waveguide member. The waveguide member has a first side face, a second side face, and a third side face, arranged in that order from the substrate. An angle of inclination of the first side face is smaller than an angle of inclination of the second side face. An angle of inclination of the third side face is smaller than the angle of inclination of the second side face. The angle of inclination of the second side face is smaller than 90 degrees.

Abstract: An imprint apparatus performs processing including dispensing of a resin onto an imprint region on a substrate and molding of the dispensed resin using a mold. The imprint apparatus includes a dispenser including a discharge section having an array of ports for discharging the resin, and configured to dispense the resin onto the imprint region; and a controller configured to control the dispenser, during a processing for a plurality of imprint regions of which nominal sizes are the same, such that switching is performed from one subset of the array of ports used for dispensing the resin onto one imprint region to another subset of the array of ports for dispensing the resin onto another imprint region.

Abstract: An interferometer includes: an optical system configured to generate interfering light by dividing light from a light source, and combining reference light and measurement light; a detector configured to detect the interfering light generated by the optical system; and an optical member configured to give spatial coherence to the light from the light source before the detector detects the light from the light source. The optical member gives higher spatial coherence in a second direction serving as a direction of a line of intersection of a cross section of a beam of the light incident on the optical member, and a plane including optical paths of the light from the light source before being divided by the optical system, the reference light, the measurement light, and the interfering light, than in a first direction perpendicular to the plane.

Abstract: The present invention provides a lithography apparatus including a plurality of detectors each configured to detect a mark on the substrate, and a controller configured to control a patterning so that a first operation and a second operation are alternately performed, the first operation irradiating the substrate with a beam while scan movement of the substrate is performed in a first direction, the second operation performing step movement of the substrate in a second direction different from the first direction, wherein the controller is configured to cause, in the first operation, at least one of the plurality of detectors to detect the mark, and the plurality of detectors are arranged, in the second direction, at an interval which is a positive integer multiple of a distance of the step movement.

Abstract: The present invention provides a lithography apparatus including a plurality of detectors each configured to detect a mark on the substrate, and a controller configured to control a patterning so that a first operation and a second operation are alternately performed, the first operation irradiating the substrate with a beam while scan movement of the substrate is performed in a first direction, the second operation performing step movement of the substrate in a second direction different from the first direction, wherein the controller is configured to cause, in the first operation, at least one of the plurality of detectors to detect the mark, and the plurality of detectors are arranged, in the second direction, at an interval which is a positive integer multiple of a distance of the step movement.

Abstract: At least one lithography apparatus, lithography method and method of manufacturing an article are provided herein. At least one lithography apparatus for performing patterning on a substrate, includes a stage configured to hold the substrate and be movable, an irradiation device configured to irradiate the substrate with a beam for the patterning, and a controller configured to cause the stage and the irradiation device to perform a first process of forming, on a substrate including a zeroth mark for overlay inspection, a first mark for overlay inspection to be paired with the zeroth mark and a second mark for overlay inspection, with the patterning not being performed, and to perform a second process of forming, on the substrate, a third mark for overlay inspection to be paired with the second mark, with the patterning being performed.

Abstract: An imprint apparatus which cures a resin dispensed on a substrate while the resin and a pattern surface of a mold are in contact with each other, comprises a supply portion configured to supply a gas, used to accelerate filling of a concave portion of the pattern surface of the mold with the resin, to a space which the pattern surface of the mold faces, and a controller configured to control the supply portion to supply the gas to the space before the resin and the pattern surface of the mold are brought into contact with each other, wherein the supply portion is configured to supply the gas to the space via a porous portion formed in at least part of the mold.

Abstract: A lithography apparatus for performing pattern formation on a substrate includes a stage configured to hold the substrate and be movable, an optical system configured to irradiate the substrate with an energy beam for the pattern formation, and a controller configured to set an arrangement of first and second marks for overlay inspection, which is variable with respect to a first substrate for condition setting, and control the stage and the optical system so that first processing for forming the first mark on the first substrate without the pattern formation and second processing for forming the second mark on the first substrate with the pattern formation are performed based on the set arrangement.

Abstract: The present invention provides a lithography apparatus which sequentially irradiates, with a beam, a first region and a second region, that have a stitching region in common, on a substrate to form a pattern on the substrate, the apparatus including a processor configured to respectively give weights to first information of a position of the second region before irradiation of the first region with a beam and second information of a position of the second region after the irradiation to obtain information of a position of the second region.

Abstract: The present invention provides a lithography apparatus which forms a pattern by sequentially irradiating a first region and a second region on a substrate with a beam, the apparatus including a beam detector configured to detect the beam, and a processor configured to obtain position information of the second region by giving a weight to first position information of the second region based on an output from the beam detector before irradiation of the first region with the beam, and giving a weight to second position information of the second region based on an output from the beam detector after the irradiation.