Patents by Inventor Hideki ISHIGAMI

Hideki ISHIGAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933857
    Abstract: Provided is a battery residual value determination system capable of easily and accurately determining the residual value of a battery. The battery residual value determination system includes: a battery information reception unit that receives information on the voltage, the current, the temperature, and the period of time elapsed from the time of manufacture of a battery; a first residual value determination unit that determines a first residual value indicating the SOH of the battery; an attenuation function determination unit that determines an attenuation function which indicates a time-dependent change of the SOH specific to the battery and is used for correcting the first residual value of the battery; and a second residual value output unit that determines and outputs a second residual value obtained by correcting the first residual value by using the attenuation function according to the period of time elapsed from the time of manufacture of the battery.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: March 19, 2024
    Assignee: TOYO SYSTEM CO., LTD.
    Inventors: Ichiro Munakata, Toshiaki Kanari, Masahiro Shoji, Katsunari Matsumoto, Ryo Ishigami, Takanori Anrui, Misaki Shimoyamada, Hideki Shoji
  • Publication number: 20230311409
    Abstract: Provided is a method for manufacturing a three-dimensional shaped object, the manufacturing method including: a powder layer formation step of disposing powders containing a forming material of the three-dimensional shaped object in a layer shape and forming a powder layer having a predetermined thickness; and a molded body formation step of discharging, to the powder layer, a binder liquid containing a binder for binding the powders to one another, and forming a molded body in which the powders are bound to one another. In the molded body formation step, in a formation region of the molded body in the powder layer, a discharging amount of the binder liquid per unit area to a first formation region that is a contour portion of the formation region and a discharging amount of the binder liquid per unit area to a second formation region other than the contour portion are discharging amounts different from each other.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 5, 2023
    Inventors: Masaya ISHIDA, Momoko WAKABAYASHI, Toshiki SANO, Hideki ISHIGAMI, Kei HIRUMA, Seiichi TANIGUCHI, Kenji KITADA
  • Patent number: 9954160
    Abstract: A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: April 24, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Hideki Ishigami, Hidefumi Nakamura, Yukihiko Shiohara, Tetsuya Otsuki, Tetsuro Miyao
  • Patent number: 9769934
    Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: September 19, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Tetsuro Miyao, Hideki Ishigami, Yukihiko Shiohara, Tetsuya Otsuki, Hidefumi Nakamura
  • Patent number: 9597767
    Abstract: A polishing media is formed of a sintered body in which a metal structure and a ceramic structure are intermingled with each other. The polishing media is preferably produced by molding a mixed powder of a metal powder and a ceramic powder by an injection molding method and sintering the resulting molded article. Further, the ceramic structure is preferably formed of aluminum oxide, and the metal structure is preferably formed of tungsten.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: March 21, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Hideki Ishigami, Hidefumi Nakamura, Junichi Hayashi
  • Publication number: 20160021752
    Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 21, 2016
    Inventors: Tetsuro MIYAO, Hideki ISHIGAMI, Yukihiko SHIOHARA, Tetsuya OTSUKI, Hidefumi NAKAMURA
  • Patent number: 9219218
    Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: December 22, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Hideki Ishigami, Hidefumi Nakamura, Yukihiko Shiohara, Taku Kawasaki, Fumiaki Akahane
  • Publication number: 20150216637
    Abstract: A dental component is formed from a sintered body of a metal powder having particles containing Co, Cr, Mo, and Si as constituent components. In the particles, Co is contained as a main component, the content of Cr is 26% by mass or more and 35% by mass or less, the content of Mo is 5% by mass or more and 12% by mass or less, and the content of Si is 0.3% by mass or more and 2.0% by mass or less. The dental component has excellent proof stress and corrosion resistance. It is preferred that a part of Si in the sintered body is contained as silicon oxide, and the ratio of the content of Si contained as the silicon oxide to the content of Si in the sintered body is 20% or more and 80% or less.
    Type: Application
    Filed: February 5, 2015
    Publication date: August 6, 2015
    Inventors: Isshin NARUMI, Hidefumi NAKAMURA, Hideki ISHIGAMI, Michio ITO
  • Publication number: 20150223325
    Abstract: A base substrate includes a ceramic sintered substrate having through holes, first and second metal wirings which are integrally disposed so as to be connected to the surface of the ceramic sintered substrate and the inside of the through holes, and first and second active metal layers which are disposed between the ceramic sintered substrate and the first and second metal wirings.
    Type: Application
    Filed: February 3, 2015
    Publication date: August 6, 2015
    Inventors: Tetsuro MIYAO, Hideki ISHIGAMI, Yukihiko SHIOHARA, Tetsuya OTSUKI, Hidefumi NAKAMURA
  • Publication number: 20150217371
    Abstract: A manufacturing method of a compact including pressure molding a composition including a metallic powder and a binder to obtain a green compact in which a relative density of a constituent material of the metallic powder with respect to real density is greater than or equal to 70% and less than or equal to 90%; and processing the green compact to obtain a compact.
    Type: Application
    Filed: January 19, 2015
    Publication date: August 6, 2015
    Inventors: Isshin NARUMI, Hidefumi NAKAMURA, Hideki ISHIGAMI
  • Patent number: 9073121
    Abstract: In a method for producing a sintered compact, a composition containing metal powder and an organic binder is formed into a given shape. When baking is performed by using a baking furnace inside of which a jig containing silica is provided, a furnace atmosphere of the baking furnace is set to be an atmosphere of inert gas, a furnace pressure is controlled to be 0.1 kPa or more but 100 kPa or less, and the furnace pressure during baking is increased at a time when the process is in the middle of heating-up.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: July 7, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Hidefumi Nakamura, Hideki Ishigami
  • Publication number: 20150188024
    Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.
    Type: Application
    Filed: December 22, 2014
    Publication date: July 2, 2015
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Yukihiko SHIOHARA, Taku KAWASAKI, Fumiaki AKAHANE
  • Publication number: 20150130326
    Abstract: A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 14, 2015
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Yukihiko SHIOHARA, Tetsuya OTSUKI, Tetsuro MIYAO
  • Publication number: 20150114178
    Abstract: A metal powder for powder metallurgy contains Fe as a principal component, Cr in a proportion of 10% by mass or more and 30% by mass or less, C in a proportion of 0.15% by mass or more and 1.5% by mass or less, Si in a proportion of 0.3% by mass or more and 1% by mass or less, Zr in a proportion of 0.01% by mass or more and 0.5% by mass or less, Nb in a proportion of 0.01% by mass or more and 0.5% by mass or less, and Mn and Ni in a total proportion of 0.05% by mass or more and 1.6% by mass or less. Further, the metal powder for powder metallurgy preferably has a crystal structure of martensite-based stainless steel.
    Type: Application
    Filed: October 30, 2014
    Publication date: April 30, 2015
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Yukihiko SHIOHARA
  • Publication number: 20150070855
    Abstract: A circuit board includes a ceramics substrate composed of ceramics and a conductor portion provided on the ceramics substrate. The conductor portion is composed of a stacked body including, in order from the ceramics substrate side, an under layer that contains a Group 6 element and a glass material, and a metal layer that contains a low-melting-point metal. A portion of the low-melting-point metal constituting the metal layer migrates to the under layer.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 12, 2015
    Inventors: Tetsuro MIYAO, Tetsuya OTSUKI, Hideki ISHIGAMI, Yukihiko SHIOHARA, Hidefumi NAKAMURA
  • Publication number: 20130256957
    Abstract: A translucent alumina has an alumina content of 99.98% by mass or more and a density of 3.97 g/cm3 or more, and in which the volume percentage of crystal textures having an aspect ratio of 1.5 or less and a long axis length of 10 ?m or less is 93% or more.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 3, 2013
    Applicant: Seiko Epson Corporation
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Junichi HAYASHI
  • Patent number: 8420006
    Abstract: A method of manufacturing a translucent ceramic is provided. The method comprises: mixing a raw powder and an organic binder and kneading them to obtain a compound, the raw powder containing an aluminum oxide powder and a magnesium oxide powder, and the organic binder containing a first organic component and a second organic component; molding the compound in a predetermined shape by an injection molding method to obtain a green body; debinding the organic binder contained in the green body to obtain a brown body; and sintering the brown body to obtain a sintered body of the translucent ceramic. When the softening point of the first organic component is defined as “T1” (° C.) and the softening point of the second organic component is defined as “T2” (° C.), the kneading step is carried out at a temperature in the range of T2 or higher but lower than T1 after the raw powder and the organic binder are preheated at a temperature in the range of T1 to T1+100(° C.). An orthodontic member is also provided.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: April 16, 2013
    Assignee: Seiko Epson Corporation
    Inventors: Masaaki Sakata, Junichi Hayashi, Hideki Ishigami
  • Publication number: 20120252322
    Abstract: A polishing media is formed of a sintered body in which a metal structure and a ceramic structure are intermingled with each other. The polishing media is preferably produced by molding a mixed powder of a metal powder and a ceramic powder by an injection molding method and sintering the resulting molded article. Further, the ceramic structure is preferably formed of aluminum oxide, and the metal structure is preferably formed of tungsten.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Junichi HAYASHI
  • Publication number: 20110314964
    Abstract: There is disclosed a compound for powder metallurgy including a binder composition for powder metallurgy and a metal powder. The binder composition for powder metallurgy includes a hydrocarbon-based resin and wax, wherein the content of oxygen is 20 mass % or less. The content of the hydrocarbon-based resin in the compound for powder metallurgy is 1 to 2 times the content of the wax, by mass ratio. It is preferable that the binder composition further includes a copolymer formed through a copolymerization of a first monomer including a cyclic ether group with a second monomer.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hideki ISHIGAMI, Masaaki SAKATA, Junichi HAYASHI, Hidefumi NAKAMURA
  • Publication number: 20110280759
    Abstract: In a method for producing a sintered compact, a composition containing metal powder and an organic binder is formed into a given shape. When baking is performed by using a baking furnace inside of which a jig containing silica is provided, a furnace atmosphere of the baking furnace is set to be an atmosphere of inert gas, a furnace pressure is controlled to be 0.1 kPa or more but 100 kPa or less, and the furnace pressure during baking is increased at a time when the process is in the middle of heating-up.
    Type: Application
    Filed: May 10, 2011
    Publication date: November 17, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hidefumi NAKAMURA, Hideki ISHIGAMI