Patents by Inventor Hideki Kaihotsu

Hideki Kaihotsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer transfer plate
    Patent number: 5669644
    Abstract: A wafer transfer plate adapted to be disposed on a wafer transfer unit for transferring a wafer within a wafer manufacturing system, which comprises at least one wafer contact portion designed to be held in contact with the wafer as the wafer transfer plate is loaded with the wafer, a coated film being formed of a material which does not contain harmful elements and provided at a region including the wafer contact portion.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: September 23, 1997
    Assignee: Kokusai Electric Co., Ltd.
    Inventors: Hideki Kaihotsu, Kazuhiro Shimeno, Kouji Tometsuka
  • Thermal treatment furnace in a system for manufacturing semiconductors
    Patent number: 5632820
    Abstract: A thermal treatment furnace for use with a semiconductor system is provided. The thermal treatment furnace includes a scavenger which sealingly encloses a lower end of a reaction tube so as to diminish gas leakage from the reaction tube.
    Type: Grant
    Filed: April 20, 1995
    Date of Patent: May 27, 1997
    Assignee: Kokusai Electric Co., Ltd.
    Inventors: Tomoshi Taniyama, Hideki Kaihotsu, Yoshikatsu Kanamori, Kazuhito Ikeda, Shuji Yonemitsu