Patents by Inventor Hideki Kameda

Hideki Kameda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of recovering a heat shrinkable magnetic shielding article over an electrical component
    Patent number: 4699743
    Abstract: An article comprising a magnetic shielding thermoplastic polymeric material containing a powdery ferrite and a heat shrinkable thermoplastic polymeric material layer. Due to its specific structure, this article is excellent in applicability over any electrical component, and may provide over the component a cover having excellent magnetic shielding and mechanical strength properties. It may also bring about a substantial increase in inductance of the component.
    Type: Grant
    Filed: August 30, 1985
    Date of Patent: October 13, 1987
    Assignee: Fujikura Ltd
    Inventors: Koichi Nakamura, Masashi Ishibashi, Hideki Kameda, Minoru Makiyo
  • Heat shrinkable magnetic shielding article
    Patent number: 4555422
    Abstract: An article comprising a magnetic shielding thermoplastic polymeric material containing a powdery ferrite and a heat shrinkable thermoplastic polymeric material layer. Due to its specific structure, this article is excellent in applicability over any electrical component, and may provide over the component a cover having excellent magnetic shielding and mechanical strength properties. It may also bring about a substantial increase in inductance of the component.
    Type: Grant
    Filed: January 10, 1984
    Date of Patent: November 26, 1985
    Assignee: Fujikura Ltd
    Inventors: Koichi Nakamura, Masashi Ishibashi, Hideki Kameda, Minoru Makiyo