Patents by Inventor Hideki Kamimura

Hideki Kamimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134596
    Abstract: The content output device includes an information acquisition unit, a content generation unit and an output unit. The information acquisition unit acquires driving state information which is information related to a current driving state of a vehicle. The content generation unit acquires one or more content elements corresponding to a trigger condition, from among a plurality of content elements combinable with each other, when the driving state information satisfies the trigger condition, and generates an output content using the acquired content elements. The output unit outputs the output content.
    Type: Application
    Filed: June 29, 2021
    Publication date: April 25, 2024
    Inventors: Takashi IIZAWA, Keita KURAMOCHI, Atsuhiro YAMANAKA, Hideki NAGATA, Kazuaki TANAKA, Kyoichi TERAO, Takashi KAMIMURA, Daiki WAGURI, Yuya ISHIZAKI, Kei SUZUKI, Takayuki SHIMAZU
  • Patent number: 10254187
    Abstract: A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a frame configured to be attached to the edge of the cavity package and has a surface more smoothed than the edge and an opening, a contact prevention member configured to be attached to the frame, and a pressure introducing hole having a diameter smaller than a diameter of the opening at a position overlapping the opening, and a gel agent configured to be provided in the recess and the opening, in which the gel agent is provided to be separated from an edge of the pressure introducing hole on the frame side.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: April 9, 2019
    Assignee: ALPS ALPINE CO., LTD.
    Inventors: Hisanobu Okawa, Eiji Umetsu, Hideki Kamimura
  • Patent number: 9804049
    Abstract: In a pressure detection device which is provided in an intake pressure measurement apparatus, a detection space surrounded by an outer wall portion is formed in a housing, and an inner wall portion is formed integrally in the detection space such that both end portions are connected to the outer wall portion. The inner wall portion has a cylindrical shape, and a sensor storage portion is formed between the inner wall portion and the outer wall portion. In the sensor storage portion, a pressure sensor is disposed in a region with the least influence of thermal stress at a position closer to the inner wall portion than the outer wall portion.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: October 31, 2017
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Hisanobu Okawa, Yasuhiro Suda, Hiroshi Ishida, Hideki Kamimura
  • Publication number: 20170284886
    Abstract: A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a cover member attached to the edge of the cavity package and to be provided with a pressure introducing hole having a diameter smaller than a diameter of an opening of the recess in a plan view at a position overlapping the recess, and a gel agent configured to be provided in the recess, in which an exhaust portion is provided at the cover member at least on the recess side, the exhaust portion being capable of discharging air in the recess to the outside when the gel agent is injected from the pressure introducing hole into the recess, and the exhaust portion is filled with the gel agent.
    Type: Application
    Filed: January 5, 2017
    Publication date: October 5, 2017
    Inventors: Hisanobu OKAWA, Eiji UMETSU, Hideki KAMIMURA
  • Publication number: 20170284885
    Abstract: A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a frame configured to be attached to the edge of the cavity package and has a surface more smoothed than the edge and an opening, a contact prevention member configured to be attached to the frame, and a pressure introducing hole having a diameter smaller than a diameter of the opening at a position overlapping the opening, and a gel agent configured to be provided in the recess and the opening, in which the gel agent is provided to be separated from an edge of the pressure introducing hole on the frame side.
    Type: Application
    Filed: December 28, 2016
    Publication date: October 5, 2017
    Inventors: Hisanobu OKAWA, Eiji UMETSU, Hideki KAMIMURA
  • Publication number: 20150075266
    Abstract: In a pressure detection device which is provided in an intake pressure measurement apparatus, a detection space surrounded by an outer wall portion is formed in a housing, and an inner wall portion is formed integrally in the detection space such that both end portions are connected to the outer wall portion. The inner wall portion has a cylindrical shape, and a sensor storage portion is formed between the inner wall portion and the outer wall portion. In the sensor storage portion, a pressure sensor is disposed in a region with the least influence of thermal stress at a position closer to the inner wall portion than the outer wall portion.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 19, 2015
    Inventors: Hisanobu OKAWA, Yasuhiro SUDA, Hiroshi ISHIDA, Hideki KAMIMURA
  • Patent number: 8776597
    Abstract: A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: July 15, 2014
    Assignee: Alps Electric Co., Ltd.
    Inventors: Satoshi Waga, Sumihito Morita, Masaru Sakurai, Masaya Yamatani, Hideki Kamimura
  • Publication number: 20120000284
    Abstract: A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.
    Type: Application
    Filed: June 27, 2011
    Publication date: January 5, 2012
    Inventors: Shinya Yokoyama, Satoshi Waga, Atsushi Tondokoro, Tadashi Sakashita, Hideki Hasegawa, Sumihito Morita, Hideki Kamimura, Masaya Yamatani
  • Publication number: 20120000285
    Abstract: A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.
    Type: Application
    Filed: September 14, 2011
    Publication date: January 5, 2012
    Inventors: Satoshi Waga, Sumihito Morita, Masaru Sakurai, Masaya Yamatani, Hideki Kamimura
  • Patent number: 6008025
    Abstract: A modified thermostable DNA polymerase having 5% or less of the 3'-5' exonuclease activity of the enzyme before modification and a DNA polymerase composition for amplifying nucleic acid, which comprises the modified thermostable DNA polymerase having 0 to 5% of the 3'-5' exonuclease activity of the enzyme before modification and an unmodified thermostable DNA polymerase having 3'-5' exonuclease activity or a modified thermostable DNA polymerase having 100 to 6% of the 3'-5' exonuclease activity of a thermostable DNA polymerase before modification; a method for amplifying nucleic acid by use of said modified thermostable polymerase or said DNA polymerase composition; and a reagent therefor.
    Type: Grant
    Filed: July 29, 1997
    Date of Patent: December 28, 1999
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hideyuki Komatsubara, Masao Kitabayashi, Hideki Kamimura, Bunsei Kawakami, Yoshihisa Kawamura, Masahiro Takagi, Tadayuki Imanaka
  • Patent number: 5990302
    Abstract: A method for isolating a ribonucleic acid, which comprises dissolution of a sample containing the ribonucleic acid, such as cells, in an acidic solution containing a lithium salt and a chaotropic agent, bringing the ribonucleic acid into contact with a nucleic acid-binding carrier such as silica particles, thereby to allow selective adsorption of the ribonucleic acid alone onto said carrier, and eluting the ribonucleic acid from the nucleic acid-bound carrier; a reagent therefor; and a method for producing a cDNA from the ribonucleic acid isolated by this method. According to the present invention, a high purity ribonucleic acid can be isolated quickly and safely from a sample containing the ribonucleic acid.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: November 23, 1999
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Toshihiro Kuroita, Hideki Kamimura, Bunsei Kawakami, Yoshihisa Kawamura
  • Patent number: D683634
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: June 4, 2013
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yasuo Hayakawa, Satoshi Waga, Hideki Kamimura, Masaya Yamatani, Motoki Hirayama
  • Patent number: D689390
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: September 10, 2013
    Assignee: Alps Electric Co., Ltd.
    Inventors: Hisanobu Okawa, Hiroshi Ishida, Yasuyuki Hattori, Takashi Nishimizu, Hideki Kamimura
  • Patent number: D689391
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: September 10, 2013
    Assignee: Alps Electric Co., Ltd.
    Inventors: Hisanobu Okawa, Hiroshi Ishida, Masaya Yamatani, Hideki Kamimura, Chiaki Kera, Hiroyuki Morioka, Kazuhide Nakayama