Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface, an end surface, and a side surface coupling the principal surface and the end surface. An external electrode is disposed on the element body and includes a conductive resin layer. An internal conductor is disposed in the element body and is exposed to the end surface. The element body includes a ridge portion between the end surface and the side surface, the ridge portion including a first region exposed from the conductive resin layer and a second region positioned closer to the principal surface than the first region and covered with the conductive resin layer.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.

Abstract: An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.

Abstract: A display device is provided and includes display part having first and second electrodes; and input part having substrate and detection electrode between substrate and display part, wherein display part including display area that displays image, input part including conductive layer provided between substrate and display part and overlapping detection electrode in display area, detection electrode is glued to conductive layer which has first region outside display area, first regain overlapping substrate and not overlapping detection electrode.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: Display device is provided and includes display part including first and second substrates, first and second polarizing plates, display area that includes pixel electrodes, a common electrode and display functional layer each of which is arranged between first and second substrates, display image formed by applying display voltage between pixel electrodes and common electrode in display period, input part including third substrate having back surface facing front surface of display part, detection electrodes formed on back surface of third substrate, and conductive layer provided between back surface of third substrate and front surface of display part, wherein conductive layer overlaps third substrate without through detection electrodes outside display area, and part of detection electrodes is uncovered by conductive layer outside display area.

Abstract: An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.

Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

Abstract: An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and its opening edge. The ceramic element is disposed in the recess and includes a first main surface and a second main surface opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.

Abstract: An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and a case lower surface facing opposite to its opening. The ceramic element is disposed in the recess and includes first and second main surfaces opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: Display device is provided and includes display part including first and second substrates, first and second polarizing plates, display area that includes pixel electrodes, a common electrode and display functional layer each of which is arranged between first and second substrates, display image formed by applying display voltage between pixel electrodes and common electrode in display period, input part including third substrate having back surface facing front surface of display part, detection electrodes formed on back surface of third substrate, and conductive layer provided between back surface of third substrate and front surface of display part, wherein conductive layer overlaps third substrate without through detection electrodes outside display area, and part of detection electrodes is uncovered by conductive layer outside display area.

Abstract: The reliability of a display device with an input device is improved. A plurality of detection electrodes (input position detection electrodes) forming an electrostatic capacity between them and a common electrode of a display device to detect an input position are formed on a different substrate from substrates configuring the display device. Moreover, a polarizing plate and the substrate on which the plurality of detection electrodes are formed are adhesively fixed via, for example, an adhesive layer so that the plurality of detection electrodes are fixed so as to be separated apart from the display device. Thus, a distance between electrodes (the detection electrode and a driving electrode) for detecting an input position can be set separately from a thickness of the display device, and therefore, reduction in detection sensitivity (detection reliability) for the input position due to increase in the electrostatic capacity can be suppressed.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.