Patents by Inventor Hideki Kishino

Hideki Kishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic wave absorber molding material, electromagnetic wave absorber molded element and method of manufacturing same, and electromagnetic wave absorber
    Patent number: 6943286
    Abstract: An electromagnetic wave absorber comprises an electromagnetic wave absorber molded element, plate-shaped sintered ferrite, and a metal plate. The molded element incorporates a tile-shaped base portion and a wedge-shaped apex portion disposed on the base portion. The molded element is formed by injecting slurry into a mold, the slurry being obtained through mixing a molding material for the wave absorber with water, and curing the slurry. The molding material includes a magnetic material, an inorganic fiber and an inorganic binder. When these ingredients are mixed with water, the molding material first exhibits fluidity and then a curing reaction in a temperature range of 1 to 40° C.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: September 13, 2005
    Assignee: TDK Corporation
    Inventors: Hiroshi Kurihara, Motonari Yanagawa, Kozo Hayashi, Kyoichi Fujimoto, Hideki Kishino