Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.

Abstract: Provided is an electrodeposition coating material composition comprising a perfluoropolymer compound X and a neutralized product of a methacrylate resin, wherein the perfluoropolymer compound X has a relative dielectric constant of 2.0 to 2.2, the methacrylate resin has an acid value of 10 mgKOH/g or more, and the electrodeposition coating material composition has a solid concentration of 10 to 70% by mass.

Abstract: Provided is a coated electric wire including a flat electric wire substrate and a coating layer formed on the outer periphery of the flat electric wire substrate, wherein the coating layer includes: a first layer formed of a liquid coating material composition (1) containing a polymer compound (1) having any one or both of an amide group and an imide group; a second layer formed of a liquid coating material composition (2) containing a polymer compound (2) having any one or both of an amide group and an imide group, and a fluorine-containing polymer compound (2), or of a powder coating material composition (2) containing a polymer compound (2) having any one or both of an amide group and an imide group, and a fluorine-containing polymer compound (2); and a third layer formed by extrusion of a fluorine-containing polymer compound (3).

Abstract: Provided is an insulated electric wire including a conductor and a fluororesin layer containing a melt-fabricable fluororesin that is formed on the conductor, in which a peel strength measured by peeling the fluororesin layer from the conductor is 0.30 N/mm or more.

Abstract: Provided is an insulated electric wire comprising a conductor and a coating layer formed on a periphery of the conductor, wherein the coating layer comprises a fluororesin layer containing a melt-fabricable fluororesin and a PAEK resin layer containing a polyaryl ether ketone (PAEK) resin that is formed on a periphery of the fluororesin layer, and wherein a thickness of the coating layer is 40 to 300 ?m.

Abstract: A flat wire including a flat conductor having at least one bent portion bent in an edgewise direction and a covering layer formed on the outer periphery of the flat conductor is provided, wherein the covering layer is formed by covering the flat conductor having bent portion with a heat-shrinkable tube and shrinking the heat-shrinkable tube.

Abstract: The present invention aims to provide a resin composition capable of providing a molded article that has high slidability and high impact resistance, as well as excellent tensile strength. The present invention relates to a resin composition containing an aromatic polyether ketone resin (I) and a fluororesin (II). The composition preferably has a sodium content of 120 ppm or less relative to the composition or a calcium content of 15 ppm or less relative to the composition.

Abstract: Provided are a fluororesin-containing composition having significantly improved fluidity and a method for producing the same. The fluororesin-containing composition contains 99.99 to 97% by mass of a fluororesin having a melting point of 205° C. to 225° C. and 0.01 to 2% by mass of a thermotropic liquid crystal polymer. The method for producing the fluororesin-containing composition includes kneading polychlorotrifluoroethylene and a thermotropic liquid crystal polymer at 285° C. to 320° C.

Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

Abstract: A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.

Abstract: An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec?1 and 390° C. of 0.40 to 0.75 kPa·s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec?1 and 390° C. of 0.30 kPa·s or lower. The insulating layer (B) has a thickness of 30 to 300 ?m.

Abstract: A composition for three-dimensional printing which contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The composition satisfies a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238. Also disclosed is a three-dimensionally printed article obtained by three-dimensional printing of the composition for three-dimensional printing.

Abstract: A powder composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The powder composition has a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.

Abstract: A film containing a resin composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The fluorine-containing copolymer (II) defines a dispersed phase at an average dispersed particle size of 5 µm or smaller. The aromatic polyetherketone resin (I) has a crystallinity of lower than 6%.

Abstract: A resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride, wherein the particulate boron nitride is contained in an amount of 30 to 65% by volume.

Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.

Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.

Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.

Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.