Patents by Inventor Hideki Kono

Hideki Kono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939450
    Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: March 26, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi Mukae, Hirokazu Komori, Masaji Komori, Hideki Kono, Ayane Nakaue
  • Patent number: 11739206
    Abstract: A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: August 29, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi Mukae, Hideki Kono, Masaji Komori, Hiroshi Ito
  • Publication number: 20230260672
    Abstract: An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec?1 and 390° C. of 0.40 to 0.75 kPa·s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec?1 and 390° C. of 0.30 kPa·s or lower. The insulating layer (B) has a thickness of 30 to 300 ?m.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 17, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takuma MARUHASHI, Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
  • Publication number: 20230242771
    Abstract: A composition for three-dimensional printing which contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The composition satisfies a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238. Also disclosed is a three-dimensionally printed article obtained by three-dimensional printing of the composition for three-dimensional printing.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 3, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Takuma MARUHASHI, Hideki KONO
  • Publication number: 20230235182
    Abstract: A powder composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The powder composition has a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Takuma MARUHASHI, Noriko IMADA, Hideki KONO
  • Publication number: 20230174780
    Abstract: A film containing a resin composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The fluorine-containing copolymer (II) defines a dispersed phase at an average dispersed particle size of 5 µm or smaller. The aromatic polyetherketone resin (I) has a crystallinity of lower than 6%.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 8, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Toyomitsu SEKI, Takuma MARUHASHI, Koji NAKANISHI, Hideki KONO
  • Publication number: 20230016062
    Abstract: A resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride, wherein the particulate boron nitride is contained in an amount of 30 to 65% by volume.
    Type: Application
    Filed: September 9, 2022
    Publication date: January 19, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Ayane NAKAUE, Hiroshi ITO
  • Patent number: 11472953
    Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: October 18, 2022
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Shuhei Yamaguchi, Ayane Nakaue, Masaji Komori, Hideki Kono
  • Patent number: 11332614
    Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: May 17, 2022
    Assignees: TEIJIN LIMITED, DAIKIN INDUSTRIES, LTD.
    Inventors: Shunsuke Okuzawa, Toshiyuki Miyake, Koji Nakanishi, Masaji Komori, Hideki Kono
  • Publication number: 20220135767
    Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 ?m and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 ?m. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 5, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Hirokazu KOMORI, Masaji KOMORI, Hideki KONO, Ayane NAKAUE
  • Patent number: 11261324
    Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: March 1, 2022
    Assignees: DAIKIN INDUSTRIES, LTD., TEIJIN LIMITED
    Inventors: Koji Nakanishi, Masaji Komori, Hideki Kono, Shunsuke Okuzawa, Toshiyuki Miyake
  • Publication number: 20220010131
    Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
  • Publication number: 20210332229
    Abstract: Provided are a resin composition having excellent heat dissipation properties as well as excellent moldability, and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.
    Type: Application
    Filed: August 23, 2019
    Publication date: October 28, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirofumi MUKAE, Hideki KONO, Masaji KOMORI, Hiroshi ITO
  • Publication number: 20210253841
    Abstract: Provided are a fluororesin-containing composition having significantly improved fluidity and a method for producing the same. The fluororesin-containing composition contains 99.99 to 97% by mass of a fluororesin having a melting point of 205° C. to 225° C. and 0.01 to 2% by mass of a thermotropic liquid crystal polymer. The method for producing the fluororesin-containing composition includes kneading polychlorotrifluoroethylene and a thermotropic liquid crystal polymer at 285° C. to 320° C.
    Type: Application
    Filed: June 24, 2019
    Publication date: August 19, 2021
    Applicants: TSINGHUA UNIVERSITY, DAIKIN INDUSTRIES, LTD.
    Inventors: Xuming XIE, Masaji KOMORI, Hideki KONO
  • Publication number: 20210206970
    Abstract: A resin composition containing a polyarylene sulfide (a); a fluorine-containing copolymer (b); and a reactive functional group-containing compound (c), the polyarylene sulfide (a) and the fluorine-containing copolymer (b) giving a mass ratio (a):(b) of 99:1 to 40:60, the compound (c) being present in an amount of 0.1 to 35 parts by mass relative to 100 parts by mass of a total of the polyarylene sulfide (a) and the fluorine-containing copolymer (b), the resin composition having a tensile elongation at break in accordance with ASTM D 638 of 15% or more.
    Type: Application
    Filed: May 23, 2019
    Publication date: July 8, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshihiro SAIGUSA, Hirofumi MUKAE, Kanako ARAI, Yuimi ISHIHARA, Haruna MATSUMOTO, Hideki KONO
  • Patent number: 11021582
    Abstract: The present invention aims to provide a method for producing a modified molded article that has favorable appearance, high breaking strength, and excellent abrasion resistance, as well as excellently low permeability to nitrogen gas and hydrochloric acid. The method for producing a modified molded article of the present invention includes molding a fluororesin to provide a molded article and irradiating the molded article with radiation at an irradiation dose of lower than 100 kGy at 50° C. to 200° C. to provide a modified molded article.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: June 1, 2021
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hitoshi Imamura, Tatsuya Funaoka, Hideki Kono
  • Patent number: 10731015
    Abstract: The present invention aims to provide a modified fluorine-containing copolymer excellent in crack resistance, a fluororesin molded article, and a method of producing a fluororesin molded article. The present invention includes a modified fluorine-containing copolymer consisting only of tetrafluoroethylene units and perfluoro(alkyl vinyl ether) units. The copolymer is modified by irradiation with radiation at an irradiation temperature not higher than the melting point of the copolymer but not lower than 200° C.
    Type: Grant
    Filed: July 4, 2013
    Date of Patent: August 4, 2020
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Kyouhei Sawaki, Hideki Kono, Hitoshi Imamura, Takahisa Aoyama, Masamichi Sukegawa
  • Publication number: 20200140682
    Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.
    Type: Application
    Filed: June 25, 2018
    Publication date: May 7, 2020
    Applicants: TEIJIN LIMITED, Daikin Industries, Ltd.
    Inventors: Shunsuke OKUZAWA, Toshiyuki MIYAKE, Koji NAKANISHI, Masaji KOMORI, Hideki KONO
  • Publication number: 20200123368
    Abstract: A resin composition containing a fluorine-containing polymer and a methacrylate resin. The fluorine-containing polymer and the methacrylate resin have a mass ratio of 35/65 to 95/5. The fluorine-containing polymer contains a vinylidene fluoride unit and a tetrafluoroethylene unit. The vinylidene fluoride unit and the tetrafluoroethylene unit have a mole ratio of 81/19 to 99/1. Also disclosed is a molded article containing the resin composition.
    Type: Application
    Filed: April 11, 2018
    Publication date: April 23, 2020
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Shuhei YAMAGUCHI, Ayane NAKAUE, Masaji KOMORI, Hideki KONO
  • Publication number: 20200123377
    Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Aso disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.
    Type: Application
    Filed: June 25, 2018
    Publication date: April 23, 2020
    Applicants: DAIKIN INDUSTRIES, LTD, TEIJIN LIMITED
    Inventors: Koji NAKANISHI, Masaji KOMORI, Hideki KONO, Shunsuke OKUZAWA, Toshiyuki MIYAKE