Abstract: A communication device may include: a memory configured to store management information in which, for each of a plurality of OIDs of a MIB, the OID and a setting value are associated with each other; and a controller, wherein the controller may be configured to: receive a setting command which conforms to TCP; write the setting value included in the setting command to the management information in association with the OID included in the setting command; and send a response command which conforms to the TCP. In a case where the setting command including a first OID and a first setting value is received, the controller may be configured to: write the first setting value to the management information in association with the first OID after the response command has been sent, and send the response command before the first setting value is written to the management information.

Abstract: Filling of a powder particle material is executed for a flexible container bag (hereinafter, referred to as “flex container bag”) by executing a powder particle material filling step of filling the flex container bag with the powder particle material by supplying the powder particle material to the flex container bag, and a tapping step of executing a lifting operation of lifting up the flex container bag filled with the powder particle material to cause the flex container bag to be distant from a floor surface or a base bed thereabove and a dropping operation of dropping the flex container bag by releasing the lifting by the lifting operation to cause the flex container bag to collide with the floor surface or the base bed. The handling property of the flex container bag filled with the powder particle material can further be improved.

Abstract: A composite substrate comprising a monocrystalline support substrate made of an insulating material and a monocrystalline semiconductor part disposed as a layer on the upper surface of the support substrate. An interface region having a thickness of 5 nm from the bonding interface between the support substrate and the semiconductor part towards the semiconductor part side includes a metal comprising: a metal element excluding the materials constituting the main components of the support substrate and the semiconductor part; and an inert element selected from the group consisting of Ar, Ne, Xe, and Kr. The number of atoms per unit area of the inert element is greater than that of the metal and smaller than that of the element constituting the semiconductor part.

Abstract: Provided is a device in which the metal content existing in a joining interface is controlled. A manufacturing method for the device comprises: a step in which the surfaces of a first substrate and a second substrate are activated using a FAB gun; a step in which a plurality of metals are discharged by using the FAB gun to sputter a discharged metal body comprising the plurality of metals, and the plurality of metals are affixed to the surfaces of the first substrate and the second substrate; a step in which the first substrate and the second substrate are joined at room temperature; and a step in which heating is performed at a temperature that is high in comparison to the agglomeration start temperature of the plurality of metals and of the elements that constitute the first substrate or the second substrate.

Abstract: A composite substrate 1 according to the present invention comprises: a supporting substrate 10 that is formed of an insulating material; a semiconductor part 20 that is disposed over the supporting substrate 10; and interfacial inclusions 30 that are present at the interface between the supporting substrate 10 and the semiconductor part 20 and contains Ni and Fe so that the ratio of Ni to Fe is 0.4 or more. Consequently, the present invention is able to provide a highly reliable composite substrate wherein the interfacial inclusions 30 are prevented from diffusing into the semiconductor part 20.

Abstract: Provided is a method for producing water-absorbent resin particles suitable for use in absorbent article and the like, the water-absorbent resin particles having better water-absorbent performance, a suitable particle size, and a narrow particle-size distribution. A method for producing water-absorbent resin particles by reversed-phase suspension polymerization of a water-soluble ethylenic unsaturated monomer in a carrier fluid, wherein the method for producing water-absorbent resin particles comprises conducting the reversed-phase suspension polymerization reaction in the presence of an organic acid monoglyceride.

Abstract: Provided is a composite substrate which has a high-performance semiconductor layer. A composite substrate of the present invention comprises: a supporting substrate which is formed of an insulating material; a semiconductor layer which is formed of a single crystal semiconductor that is superposed on and joined to the supporting substrate; and interfacial inclusions which are present in the interface between the supporting substrate and the semiconductor layer at a density of 1012 atoms/cm2 or less, and which are formed of a metal element that is different from the constituent elements of the supporting substrate and the semiconductor layer.

Abstract: Provided is a method for producing water-absorbent resin particles suitable for use in absorbent article and the like, the water-absorbent resin particles having better water-absorbent performance, a suitable particle size, and a narrow particle-size distribution. A method for producing water-absorbent resin particles by reversed-phase suspension polymerization of a water-soluble ethylenic unsaturated monomer in a carrier fluid, wherein the method for producing water-absorbent resin particles comprises conducting the reversed-phase suspension polymerization reaction in the presence of an organic acid monoglyceride.

Abstract: A composite substrate 1 according to the present invention comprises: a supporting substrate 10 that is formed of an insulating material; a semiconductor part 20 that is disposed over the supporting substrate 10; and interfacial inclusions 30 that are present at the interface between the supporting substrate 10 and the semiconductor part 20 and contains Ni and Fe so that the ratio of Ni to Fe is 0.4 or more. Consequently, the present invention is able to provide a highly reliable composite substrate wherein the interfacial inclusions 30 are prevented from diffusing into the semiconductor part 20.

Abstract: Provided is a lead frame made of a Cu—Fe-based copper alloy strip to improve the heat dissipation in an LED package. An Ag plating reflective film formed on the lead frame enhances the brightness of the LED package. In the Cu—Fe-based copper alloy strip, arithmetic mean roughness Ra is 0.2 ?m or less, ten-point mean roughness RzJIS is 1.2 ?m or less, and maximum height roughness Rz is 1.5 ?m or less and depressions having an average length in a rolling parallel direction of 2 to 100 ?m, an average length in the rolling vertical direction of 1-30 ?m, and a maximum depth along the rolling parallel direction of 400 nm or less. The Cu—Fe-based copper alloy strip contains 1.8-2.6 mass % of Fe, 0.005-0.20 mass % of P, and 0.01-0.50 mass % of Zn or contains 0.01-0.5 mass % of Fe, 0.01-0.20 mass % of P, 0.01-1.0 mass % of Zn, and 0.01-0.15 mass % of Sn.

Abstract: A composite substrate comprising a monocrystalline support substrate made of an insulating material and a monocrystalline semiconductor part disposed as a layer on the upper surface of the support substrate. An interface region having a thickness of 5 nm from the bonding interface between the support substrate and the semiconductor part towards the semiconductor part side includes a metal comprising: a metal element excluding the materials constituting the main components of the support substrate and the semiconductor part; and an inert element selected from the group consisting of Ar, Ne, Xe, and Kr[[Xr]]. The number of atoms per unit area of the inert element is greater than that of the metal and smaller than that of the element constituting the semiconductor part.

Abstract: A water-absorbent sheet structure comprising a structure in which an absorbent layer containing a water-absorbent resin is sandwiched with a hydrophilic nonwoven fabric from an upper side and a lower side of the absorbent layer, characterized in that at least one side of the upper side and the lower side of the water-absorbent sheet structure is subjected to embossing, wherein a central region W1 of a water-absorbent sheet structure 1 along a longitudinal direction of the structure 1 is subjected to: wavy embossing 2 comprising one wavy embossing extending along the longitudinal direction, wherein the embossing comprises one or more discontinued segments of the embossing, and linear embossing 4 in a direction from each of tips 3 of wavy forms formed by the wavy embossing 2 towards an edge portion contouring along the longitudinal direction of the water-absorbent sheet structure 1, and wherein a branched structure of embossing formed by the wavy embossing 2 and the linear embossing 4 has an approximate Y-shape

Abstract: Provided is a composite substrate which has a high-performance semiconductor layer. A composite substrate of the present invention comprises: a supporting substrate which is formed of an insulating material; a semiconductor layer which is formed of a single crystal semiconductor that is superposed on and joined to the supporting substrate; and interfacial inclusions which are present in the interface between the supporting substrate and the semiconductor layer at a density of 1012 atoms/cm2 or less, and which are formed of a metal element that is different from the constituent elements of the supporting substrate and the semiconductor layer.

Abstract: Provided is a device in which the metal content existing in a joining interface is controlled. A manufacturing method for the device comprises: a step in which the surfaces of a first substrate and a second substrate are activated using a FAB gun; a step in which a plurality of metals are discharged by using the FAB gun to sputter a discharged metal body comprising the plurality of metals, and the plurality of metals are affixed to the surfaces of the first substrate and the second substrate; a step in which the first substrate and the second substrate are joined at room temperature; and a step in which heating is performed at a temperature that is high in comparison to the agglomeration start temperature of the plurality of metals and of the elements that constitute the first substrate or the second substrate.

Abstract: A water-absorbent sheet structure (10) including a structure in which an absorbent layer (13) containing a water-absorbent resin (12) and an adhesive (11) is sandwiched with nonwoven fabrics from an upper side and a lower side of the absorbent layer, the water-absorbent sheet structure (10) comprising (1) an upper nonwoven fabric (14) which is a water-permeable nonwoven fabric having a water permeation rate of 10 s or less; and (2) a lower nonwoven fabric (15) which is a water-retaining nonwoven fabric having an amount of water absorbed of 250 g/m2 or more. The water-absorbent sheet structure (10) of the present invention is thin and is capable of sufficiently exhibiting water-absorbent capacities such as fast liquid permeability, a small amount of liquid re-wet, and a small amount of liquid leakage.

Abstract: Provided is a lead frame made of a Cu—Fe-based copper alloy strip to improve the heat dissipation in an LED package. An Ag plating reflective film formed on the lead frame enhances the brightness of the LED package. In the Cu—Fe-based copper alloy strip, arithmetic mean roughness Ra is 0.2 ?m or less, ten-point mean roughness RzJIS is 1.2 ?m or less, and maximum height roughness Rz is 1.5 ?m or less and depressions having an average length in a rolling parallel direction of 2 to 100 ?m, an average length in the rolling vertical direction of 1-30 ?m, and a maximum depth along the rolling parallel direction of 400 nm or less. The Cu—Fe-based copper alloy strip contains 1.8-2.6 mass % of Fe, 0.005-0.20 mass % of P, and 0.01-0.50 mass % of Zn or contains 0.01-0.5 mass % of Fe, 0.01-0.20 mass % of P, 0.01-1.0 mass % of Zn, and 0.01-0.15 mass % of Sn.

Abstract: A water-absorbent sheet structure comprising a structure in which an absorbent layer containing a water-absorbent resin is sandwiched with a hydrophilic nonwoven fabric from an upper side and a lower side of the absorbent layer, characterized in that at least one side of the upper side and the lower side of the water-absorbent sheet structure is subjected to embossing, wherein a central region W1 of a water-absorbent sheet structure 1 along a longitudinal direction of the structure 1 is subjected to: wavy embossing 2 comprising one wavy embossing extending along the longitudinal direction, wherein the embossing comprises one or more discontinued segments of the embossing, and linear embossing 4 in a direction from each of tips 3 of wavy forms formed by the wavy embossing 2 towards an edge portion contouring along the longitudinal direction of the water-absorbent sheet structure 1, and wherein a branched structure of embossing formed by the wavy embossing 2 and the linear embossing 4 has an approximate Y-shape

Abstract: A water-absorbent sheet structure comprising a structure in which an absorbent layer containing a water-absorbent resin is sandwiched with a hydrophilic nonwoven fabric from an upper side and a lower side of the absorbent layer, characterized in that at least one side of a topside and an underside of the water-absorbent sheet structure is subjected to embossing, and that the water-absorbent sheet structure has the following properties: when a saline solution is allowed to be absorbed in an amount of 4 L per 1 m2 of the water-absorbent sheet structure (4 L/m2), the water-absorbent sheet structure satisfies both of the following relationships of (A) and (B): (A) an expansion thickness ratio, i.e. T2/T1, of 2 or more, and (B) an expansion embossing depth, i.e. (T2?t2)/T2, of 0.

Abstract: A water-absorbent sheet structure comprises a structure in which an absorbent layer comprising a water-absorbent resin and an adhesive is sandwiched with nonwoven fabrics from an upper side and a lower side of the absorbent layer, wherein the water-absorbent resin is contained in an amount of from 100 to 1,000 g/m2, and wherein a mass-average particle size of the water-absorbent resin is from 50 to 800 ?m, and wherein a particle size rate index of the water-absorbent resin is 0.12 s/?m or less, and wherein the water-absorbent sheet structure has a peeling strength of from 0.05 to 3.0 N/7 cm.

Abstract: A water-absorbent sheet structure comprises a structure in which an absorbent layer comprising a water-absorbent resin and an adhesive is sandwiched with nonwoven fabrics from an upper side and a lower side of the absorbent layer, wherein the water-absorbent resin is contained in an amount of 10 g/m2 or more and less than 100 g/m2, and wherein the water-absorbent resin has a water-retention capacity of saline solution of from 35 to 80 g/g, and wherein the water-absorbent sheet structure has a peeling strength of from 0.05 to 3.0 N/7 cm.