Patents by Inventor Hideki Minato
Hideki Minato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11936526Abstract: The network device information management apparatus includes: a log data acquisition unit configured to acquire log data from each of the plurality of devices, the log data including information about components of the plurality of devices; and an inventory information estimation unit configured to exclude a common portion of the log data before and after registration of the component to extract a component configuration indicating information about the component newly registered to the device, compare the extracted component configuration with the component configuration extracted from a component registered to another device, estimate the common portion as inventory information, and store the estimated inventory information in storage means.Type: GrantFiled: June 21, 2019Date of Patent: March 19, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Masahiro Yokota, Masatoshi Namiki, Yuji Minato, Masaaki Inami, Daisaku Shimazaki, Hideki Maeda
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Publication number: 20240013111Abstract: An automation support device includes a processor and a storage unit. In this automation support device, the storage unit stores a man-hour estimation rule that is a rule for estimating man-hours for automation of a work procedure manual related to a procedure of work. Then, the processor calculates man-hours required for automation of the work procedure manual by using the man-hour estimation rule stored in the storage unit with the work procedure manual and a work execution record which is a record of execution according to the work procedure manual as inputs.Type: ApplicationFiled: February 22, 2023Publication date: January 11, 2024Applicant: Hitachi, Ltd.Inventors: Mineyoshi MASUDA, Koichi Murayama, Hideki Minato
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Patent number: 9025336Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.Type: GrantFiled: December 2, 2013Date of Patent: May 5, 2015Assignee: Denso CorporationInventors: Hideki Minato, Hideki Kabune, Atsushi Furumoto
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Publication number: 20140084722Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.Type: ApplicationFiled: December 2, 2013Publication date: March 27, 2014Applicant: DENSO CORPORATIONInventors: Hideki MINATO, Hideki Kabune, Atsushi Furumoto
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Patent number: 8683025Abstract: A host server of a storage system transmits path information and a simultaneous command issue number to a storage managing server, while the path information corresponds to such paths that when the host server executes an application program, the host server accesses to a logical volume, the simultaneous command issue number corresponds to a total number of commands issued to the respective paths. A storage monitoring agent server transmits to the storage managing server, an upper limit number of command multiplex numbers. When accepting path information, a simultaneous command issue number, and the command multiplex number upper limit value, the storage managing server proportionally distributes the command multiplex number upper limit value of the port to the respective paths so as to calculate a command multiplex upper limit value, and calculated result.Type: GrantFiled: July 21, 2008Date of Patent: March 25, 2014Assignee: Hitachi, Ltd.Inventor: Hideki Minato
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Patent number: 8630095Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.Type: GrantFiled: June 24, 2010Date of Patent: January 14, 2014Assignee: Denso CorporationInventors: Hideki Minato, Hideki Kabune, Atsushi Furumoto
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Patent number: 8436500Abstract: In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.Type: GrantFiled: April 15, 2011Date of Patent: May 7, 2013Assignee: Denso CorporationInventor: Hideki Minato
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Patent number: 8310121Abstract: A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.Type: GrantFiled: June 24, 2010Date of Patent: November 13, 2012Assignee: Denso CorporationInventors: Toshihiro Fujita, Hiroyasu Kidokoro, Atsushi Furumoto, Hideki Kabune, Hideki Minato
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Patent number: 8247937Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.Type: GrantFiled: June 24, 2010Date of Patent: August 21, 2012Assignee: Denso CorporationInventors: Hideki Minato, Hideki Kabune, Atsushi Furumoto, Ayako Iwai
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Publication number: 20110254411Abstract: In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.Type: ApplicationFiled: April 15, 2011Publication date: October 20, 2011Applicant: DENSO CORPORATIONInventor: Hideki MINATO
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Publication number: 20100327679Abstract: A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.Type: ApplicationFiled: June 24, 2010Publication date: December 30, 2010Applicant: DENSO CORPORATIONInventors: Toshihiro Fujita, Hiroyasu Kidokoro, Atsushi Furumoto, Hideki Kabune, Hideki Minato
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Publication number: 20100328901Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.Type: ApplicationFiled: June 24, 2010Publication date: December 30, 2010Applicant: DENSO CORPORATIONInventors: Hideki MINATO, Hideki Kabune, Atsushi Furumoto
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Publication number: 20100327709Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.Type: ApplicationFiled: June 24, 2010Publication date: December 30, 2010Applicant: DENSO CORPORATIONInventors: Hideki MINATO, Hideki Kabune, Atsushi Furumoto, Ayako Iwai
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Patent number: 7653725Abstract: To solve a problem in that reliable detection of a performance problem caused by a configuration change needs detailed performance information, which is costly to keep and analyze, a management computer which manages a computer system having a host computer and a storage system is provided. The management computer is configured to: store performance information obtained from resources that belong to paths at first time intervals until a predetermined length of time elapses since the detection of an addition or removal of the resources to the paths; store performance information obtained from the resources that belong to the paths at second time intervals, which are longer than the first time intervals, without storing performance information obtained from the resources that belong to the paths at the first time intervals after the predetermined length of time elapses since the detection of the addition or removal of the resources to the paths.Type: GrantFiled: February 4, 2008Date of Patent: January 26, 2010Assignee: Hitachi, Ltd.Inventors: Satomi Yahiro, Hideo Ohata, Hideki Minato
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Publication number: 20090307341Abstract: A host server of a storage system transmits path information and a simultaneous command issue number to a storage managing server, while the path information corresponds to such paths that when the host server executes an application program, the host server accesses to a logical volume, the simultaneous command issue number corresponds to a total number of commands issued to the respective paths. A storage monitoring agent server transmits to the storage managing server, an upper limit number of command multiplex numbers. When accepting path information, a simultaneous command issue number, and the command multiplex number upper limit value, the storage managing server proportionally distributes the command multiplex number upper limit value of the port to the respective paths so as to calculate a command multiplex upper limit value, and calculated result.Type: ApplicationFiled: July 21, 2008Publication date: December 10, 2009Inventor: Hideki MINATO
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Publication number: 20090150542Abstract: To solve a problem in that reliable detection of a performance problem caused by a configuration change needs detailed performance information, which is costly to keep and analyze, a management computer which manages a computer system having a host computer and a storage system is provided. The management computer is configured to: store performance information obtained from resources that belong to paths at first time intervals until a predetermined length of time elapses since the detection of an addition or removal of the resources to the paths; store performance information obtained from the resources that belong to the paths at second time intervals, which are longer than the first time intervals, without storing performance information obtained from the resources that belong to the paths at the first time intervals after the predetermined length of time elapses since the detection of the addition or removal of the resources to the paths.Type: ApplicationFiled: February 4, 2008Publication date: June 11, 2009Inventors: Satomi YAHIRO, Hideo OHATA, Hideki MINATO