Patents by Inventor Hideki Mitsuda

Hideki Mitsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6329049
    Abstract: A pressure-sensitive adhesive comprising 100 parts by weight of an isobutylene polymer having been masticated in an organic solvent with a radical generator and 0.001 to 5 parts by weight of at least one release control agent selected from the group consisting of an alcohol having a molecular weight of 90 to 300 and an oxygen atom content of 8.5% or more or a derivative thereof and a carboxylic acid having a molecular weight of 70 to 400 and an oxygen atom content of 11% or more or a derivative thereof; and a surface protecting material having a pressure-sensitive adhesive layer comprising the adhesive. The adhesive has well-balanced characteristics in initial adhesion, retention of initial adhesion, and weather resistance.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: December 11, 2001
    Assignees: Nitto Denko Corporation, Kansai Paint Co., Ltd.
    Inventors: Mitsuyoshi Shirai, Isamu Teranishi, Hideki Mitsuda, Akira Taguchi, Kenji Sano, Komaharu Matsui, Takeshi Eda, Hiroshi Ueda