Patents by Inventor Hideki Mitsuoka

Hideki Mitsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8089018
    Abstract: A movable contact unit, of which an upper surface of a movable contact made of a conductive metal plate is adhesively fixed to an adhesive layer formed on the underside of a base film, an upper surface of a separator is affixed to the adhesive layer in a manner to sandwich the movable contact between them, and the periphery of the movable contact is heated and pressed in a circular shape from above of the base film to form a convex-shaped portion in an area of base film corresponding to the movable contact in a manner to fit along a dome-like shape of the movable contact and to make a peripheral area or a base of the convex-shaped portion pressed circularly to close adhesion to the separator with the adhesive layer. By virtue of this structure, there can be an improvement of manufacturing efficiency of the movable contact unit.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: January 3, 2012
    Assignee: Panasonic Corporation
    Inventor: Hideki Mitsuoka
  • Publication number: 20090152090
    Abstract: Disclosed is movable contact unit 24, of which an upper surface of movable contact 23 made of a conductive metal plate is adhesively fixed to adhesive layer 22 formed on the underside of base film 21, an upper surface of separator 25 is affixed to adhesive layer 22 in a manner to sandwich movable contact 23 between them, and the periphery of movable contact 23 is heated and pressed in a circular shape from above base film 21 to form a convex-shaped portion in an area of base film 21 corresponding to movable contact 23 in a manner to fit along a dome-like shape of movable contact 23 and to make a peripheral area, or a base of the convex-shaped portion pressed circularly into close adhesion to separator 25 with adhesive layer 22. By virtue of this structure, there can be an improvement of manufacturing efficiency of movable contact unit 24.
    Type: Application
    Filed: November 13, 2008
    Publication date: June 18, 2009
    Applicant: Panasonic Corporation
    Inventor: Hideki Mitsuoka
  • Patent number: 7350285
    Abstract: A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the movable contact so that the residual magnetic flux density is smaller than the operation magnetic flux density of the magnetic sensor. In manufacturing the movable contact, elastic metal plate material is processed into a downwardly opening dome shape to form the movable contact. In a method of manufacturing a switch panel, the movable contact unit is overlaid on a wiring board having a contact, including pair an outer fixed contact and a central fixed contact, that corresponds to the movable contact so that the lower end of the outer periphery of the movable contact is mounted on the outer fixed contact.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Patent number: 7196282
    Abstract: A movable contact unit arrangement includes a movable contact disposed close to a magnetic sensor. The movable contact unit includes a base sheet made of insulating resin, and a movable contact made of elastic metal plate material and having a downwardly opening dome shape. The movable contact is stuck to the base sheet. The magnetic sensor has an operation magnetic flux density during operation, and the movable contact is a demagnetized movable contact so that a residual magnetic flux density of the movable contact is smaller than the operation flux density of the magnetic sensor.
    Type: Grant
    Filed: April 11, 2006
    Date of Patent: March 27, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Publication number: 20070050972
    Abstract: A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the movable contact so that the residual magnetic flux density is smaller than the operation magnetic flux density of the magnetic sensor. In manufacturing the movable contact, elastic metal plate material is processed into a downwardly opening dome shape to form the movable contact. In a method of manufacturing a switch panel, the movable contact unit is overlaid on a wiring board having a contact, including pair an outer fixed contact and a central fixed contact, that corresponds to the movable contact so that the lower end of the outer periphery of the movable contact is mounted on the outer fixed contact.
    Type: Application
    Filed: November 2, 2006
    Publication date: March 8, 2007
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Patent number: 7178223
    Abstract: A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the movable contact so that the residual magnetic flux density is smaller than the operation magnetic flux density of the magnetic sensor. In manufacturing the movable contact, elastic metal plate material is processed into a downwardly opening dome shape to form the movable contact. In a method of manufacturing a switch panel, the movable contact unit is overlaid on a wiring board having a contact, including pair an outer fixed contact and a central fixed contact, that corresponds to the movable contact so that the lower end of the outer periphery of the movable contact is mounted on the outer fixed contact.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: February 20, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Publication number: 20060180456
    Abstract: A manufacturing method of a movable contact unit includes the steps of (A) manufacturing a movable contact, (B) sticking the movable contact to a base sheet made of insulating resin, and (C) applying demagnetization to the movable contact so that the residual magnetic flux density is smaller than the operation magnetic flux density of the magnetic sensor. In step A, elastic metal plate material is processed into a downwardly opening dome shape to form the movable contact. In a manufacturing method of a panel switch, the movable contact unit is overlaid on a wiring board having a pair of an outer fixed contact and a central fixed contact that correspond to the movable contact so that the lower end of the outer periphery of the movable contact is mounted on the outer fixed contact.
    Type: Application
    Filed: April 11, 2006
    Publication date: August 17, 2006
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Publication number: 20060081453
    Abstract: A manufacturing method of a movable contact unit includes the steps of (A) manufacturing a movable contact, (B) sticking the movable contact to a base sheet made of insulating resin, and (C) applying demagnetization to the movable contact so that the residual magnetic flux density is smaller than the operation magnetic flux density of the magnetic sensor. In step A, elastic metal plate material is processed into a downwardly opening dome shape to form the movable contact. In a manufacturing method of a panel switch, the movable contact unit is overlaid on a wiring board having a pair of an outer fixed contact and a central fixed contact that correspond to the movable contact so that the lower end of the outer periphery of the movable contact is mounted on the outer fixed contact.
    Type: Application
    Filed: October 19, 2005
    Publication date: April 20, 2006
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Patent number: 5848462
    Abstract: An insulating film 3 is provided with an opening 4 whose size is substantially equivalent to or slightly smaller than the outer configuration of electronic component 5. A conductive pattern 2 is formed on insulating substrate 1. After forcibly inserting the main body of electronic component 5 into said opening 4, terminals 6 are put between insulating film 3 and insulating substrate 1 and disposed in such a manner that terminals 6 are brought into contact with conductive pattern 2. Then, insulating film 3 is connected with insulating substrate 1 by fusing them in a region surrounding terminals 6, thereby firmly fixing terminals 6 of electronic component 5 on conductive pattern 2.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: December 15, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoki Sera, Hideki Mitsuoka, Yoshiro Sano, Tetsutaro Nasu
  • Patent number: D563329
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: March 4, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshiro Sano, Hideki Mitsuoka, Tetsuya Fukuda