Abstract: Provided is a battery residual value determination system capable of easily and accurately determining the residual value of a battery. The battery residual value determination system includes: a battery information reception unit that receives information on the voltage, the current, the temperature, and the period of time elapsed from the time of manufacture of a battery; a first residual value determination unit that determines a first residual value indicating the SOH of the battery; an attenuation function determination unit that determines an attenuation function which indicates a time-dependent change of the SOH specific to the battery and is used for correcting the first residual value of the battery; and a second residual value output unit that determines and outputs a second residual value obtained by correcting the first residual value by using the attenuation function according to the period of time elapsed from the time of manufacture of the battery.

Abstract: A method for cleaning an SOI wafer having a silicon thin film on an insulator, wherein the SOI wafer is subjected to two-fluid cleaning in which two or more fluids are mixed and used for cleaning the wafer. Thereby, there is provided a method for cleaning an SOI wafer that sufficiently reduces impurity etc. adhered to the surface of the SOI wafer with inhibiting a decrease of film thickness and deterioration of haze level of the SOI layer of the SOI wafer as much as possible.

Abstract: There are provided a dust generation preventing structure of a wafer storage case and a process for preventing dust generation thereof, wherein dust generation is effectively prevented by blocking or suppressing free movement of particles constantly generated from a surface of a wafer storage case of a synthetic resin with a coating layer of a surfactant, and a wafer storing method using the wafer storage case. The wafer storage case of synthetic resin is used for housing wafers, and a surface of the wafer storage case is coated with a coating layer of a coating agent to prevent dust generation from the surface.

Abstract: Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning.

Abstract: There are provided a dust generation preventing structure of a wafer storage case and a process for preventing dust generation thereof, wherein dust generation is effectively prevented by blocking or suppressing free movement of particles constantly generated from a surface of a wafer storage case of a synthetic resin with a coating layer of a surfactant, and a wafer storing method using the wafer storage case. The wafer storage case of synthetic resin housing wafers, wherein a surface of the wafer storage case is coated with a coating layer of a coating agent to prevent dust generation from the surface.

Abstract: There are disclosed a method and an apparatus for drying a flat object. At least one flat object, whose surface is covered entirely with adhering water, is placed substantially vertically in at least one groove portion formed in a rack. The rack has a cavity portion formed therein, and the cavity portion communicates with the groove portion through at least one opening. The cavity portion of the rack is depressurized in order to suck water adhering to the surface of the flat object through the opening, thereby drying the flat object. It becomes possible to dry the flat object without causing problems which have been occurred in conventional drying methods.

Abstract: A wafer processing equipment of a single wafer transfer type comprising a wafer cleaning apparatus, a pure water cooling system, a pure water circulatory system, and a wafer drying apparatus for drying the cleaned wafer one by one, is disclosed. The cleaning apparatus comprises a pure water jet device for cleaning a wafer by jetting pure water to which ultrasonic wave is applied, against the main surface of the wafer, and a pure water collection tank for collecting the used water. The cooling system comprises a heat exchanger provided in the collection tank, for cooling the pure water in the collection tank. The circulatory system is for circulating pure water stored in the collection tank, through a filter for catching pollution or particles contained in the stored pure water. The drying apparatus is for drying the cleaned wafer one by one.