Patents by Inventor Hideki Nakagawara

Hideki Nakagawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate having a multiple metal protected conductive layer and method of manufacturing the same
    Patent number: 5308686
    Abstract: A substrate on which a protected conductive layer is formed. The conductive layer is formed by laminating together different kinds of conductive metal layers. A lowermost conductive metal layer of the conductive metal layers is formed on an insulating surface of a substrate body. A restraining structure contacts at least two conductive metal layers of the conductive metal layers. The restraining structure restrains elution of the conductive metal to prevent parts of the conductive metal from being eroded.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: May 3, 1994
    Assignee: Nippondenso Co., Ltd.
    Inventors: Takashi Nagasaka, Hideki Nakagawara
  • Process for manufacturing ceramic multilayer substrate
    Patent number: 5290375
    Abstract: A ceramic multilayer substrate, containing a stack of alternate ceramic and inner conductor layers, the conductor layer having a melting point higher than a lowest firing temperature of the ceramic layer, the stack having a top ceramic layer, and a conductor layer formed on the stack, the conductor layer being electrically connected to the inner conductor layer, is characterized by further including an insulating layer formed on the top ceramic layer of the stack and under the insulating layer, the insulating layer having a firing temperature lower than the lowest firing temperature of the ceramic layer.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: March 1, 1994
    Assignee: Nippondenso Co., Ltd.
    Inventors: Takashi Nagasaka, Hideki Nakagawara