Abstract: A probe assembly for inspecting power semiconductor devices, which includes a probe block having more than one probe holding hole, more than one probe, each of which is contained in one of the probe holding holes with its outer surface being in contact with the inner surface of the probe holding hole, and which has lower end protruding from the probe block and coming into contact with the power semiconductor device on inspection, and one or more cooling units which cool the probe block. According to the probe assembly and the inspection apparatus, it is possible to inspect characteristics of power semiconductor devices accurately by suppressing temperature rises of the probes as well as the power semiconductor device under test.

Abstract: An inspection apparatus is provided, which includes probes for front side electrodes, probes for back side electrodes, and a chuck stage. The probes for front side electrodes and the probes for back side electrodes are formed on the upper surface of the chuck stage, and the probe contact area electrically continues to the wafer holding area, and the probes for front side electrodes and the probes for back side electrodes are located leaving a distance in horizontal direction between them so that the probes for back side electrodes move relatively within the probe contact area when the probes for front side electrodes are moved relatively within the wafer under test by the movement of the chuck stage.