Patents by Inventor Hideki Okawa
Hideki Okawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9236551Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous existence of the light-emitting element section is equal to or higher than 10 lm/mm2 and equal to or lower than 100 lm/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.Type: GrantFiled: August 30, 2013Date of Patent: January 12, 2016Assignee: Toshiba Lighting & Technology CorporationInventors: Kiyoshi Nishimura, Kazuo Shimokawa, Nobuhiko Betsuda, Akihiro Sasaki, Miho Watanabe, Hirotaka Tanaka, Takuya Honma, Katsuhisa Matsumoto, Hideki Okawa
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Publication number: 20150144970Abstract: According to an exemplary embodiment, there is provided a light emitting device including a ceramic substrate, first to fourth connectors, a plurality of semiconductor light emitting elements, and a first metal layer. The ceramic substrate is provided with a first main surface including first to fourth sides and first to fourth corner portions, and the first main surface includes a mounting region, and first to fourth connector region provided respectively between the first to fourth corner portion and the mounting region. The plurality of semiconductor light emitting elements is provided on the mounting region. The first to fourth connectors are respectively provided on the first to fourth connector regions. A first metal layer is provided between the plurality of semiconductor light emitting elements and the ceramic substrate, and including first to fourth connector electrode portions electrically connected respectively to the first to fourth connectors.Type: ApplicationFiled: July 18, 2014Publication date: May 28, 2015Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Nobuhiko Betsuda, Akihiro Sasaki, Hideki Okawa, Kazuo Shimokawa
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Patent number: 8882305Abstract: According to one embodiment, in a constricted part of a globe, one end is set to a minimum diameter, the other end is set to a maximum diameter, and a diameter thereof increases from the one end side to the other end side. The constricted part of the globe is concaved into the inside of an imaginary straight line connecting an outer edge of the one end and an outer edge of the other end when viewed in section. A light source part includes a semiconductor light-emitting element and is contained in the globe so that a light-emitting part is positioned between both the ends of the constricted part of the globe. A cap is positioned on one end side of the globe.Type: GrantFiled: August 31, 2012Date of Patent: November 11, 2014Assignee: Toshiba Lighting & Technology CorporationInventors: Jun Sasaki, Ryotaro Matsuda, Naoto Mori, Yoshiyuki Matsunaga, Hideki Okawa, Takeo Yasuda
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Publication number: 20140218920Abstract: According to one embodiment, a lighting device is provided which includes: a module; a first cover member; and a second cover member. The module has a light emitting body and a frame. The light emitting body emits light by organic electro-luminescence. The frame is formed of a light transmitting material. The first cover member is formed of a material that is a light transmitting material and has a stiffness higher than that of the frame. The first cover member is disposed on one end side of the module. The second cover member is formed of a material that is a light transmitting material and has a stiffness higher than that of the frame. The second cover member is disposed on the other end side of the module such that the module is sandwiched between the first cover member and the second cover member.Type: ApplicationFiled: September 18, 2013Publication date: August 7, 2014Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Junya Hayashi, Hideki Okawa, Hiroshi Kamata, Yoshimasa Takahashi
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Publication number: 20140218921Abstract: According to one embodiment, there is provided a lighting device including a plurality of panels; a frame; and a connection body. The panel emits light by organic electro-luminescence. The frame is formed of a material which is an insulating material and transmits the light. The frame seals the plurality of panels. The connection body has conductivity. The panel has a substrate, a first electrode, a second electrode, a first conductive body, and a second conductive body. The first conductive body has conductivity, is connected to the first electrode, and is provided in a first side surface of the substrate. The second conductive body has conductivity, is connected to the second electrode, and is provided in a second side surface of the substrate. The plurality of panels are electrically connected to each other via the first conductive body, the second conductive body, and the connection body.Type: ApplicationFiled: September 19, 2013Publication date: August 7, 2014Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Hideki Okawa, Junya Hayashi, Hiroshi Kamata, Yoshimasa Takahashi
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Publication number: 20140153238Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm2 and equal to or lower than 1001 m/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.Type: ApplicationFiled: August 30, 2013Publication date: June 5, 2014Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Kiyoshi Nishimura, Kazuo Shimokawa, Nobuhiko Betsuda, Akihiro Sasaki, Miho Watanabe, Hirotaka Tanaka, Takuya Honma, Katsuhisa Matsumoto, Hideki Okawa
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Publication number: 20130300277Abstract: According to one embodiment, in a constricted part of a globe, one end is set to a minimum diameter, the other end is set to a maximum diameter, and a diameter thereof increases from the one end side to the other end side. The constricted part of the globe is concaved into the inside of an imaginary straight line connecting an outer edge of the one end and an outer edge of the other end when viewed in section. A light source part includes a semiconductor light-emitting element and is contained in the globe so that a light-emitting part is positioned between both the ends of the constricted part of the globe. A cap is positioned on one end side of the globe.Type: ApplicationFiled: August 31, 2012Publication date: November 14, 2013Applicant: Toshiba Lighting & Technology CorporationInventors: Jun Sasaki, Ryotaro Matsuda, Naoto Mori, Yoshiyuki Matsunaga, Hideki Okawa, Takeo Yasuda
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Publication number: 20130301280Abstract: According to one embodiment, a bulb-shaped lamp includes a light source unit, a plurality of substrates, a substrate holding member, and a globe. The respective substrates hold light source units. The substrate holding member has thermal conductivity and an insulating property and holds the respective substrates. The globe is thermally connected to the substrate holding member. The cap is positioned on one end side of the globe.Type: ApplicationFiled: March 4, 2013Publication date: November 14, 2013Applicant: Toshiba Lighting & Technology CorporationInventors: Ryotaro Matsuda, Naoto Mori, Jun Sasaki, Yoshiyuki Matsunaga, Hideki Okawa, Takeo Yasuda
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Patent number: 8404617Abstract: An object of the invention is to provide a photocatalyst material having a higher catalyst effect than conventional photocatalyst materials. The photocatalyst material of the invention contains, as its major component, a tungsten oxide powder excited by a light source which emits light having a wavelength of 430 to 500 nm, the photocatalyst material having a decomposition ability of 50% or more wherein the decomposition ability is given by the following equation based on the following test: [Test for decomposition ability]: 1 g of a tungsten oxide powder and 20 ppm of acetaldehyde (amount A) are poured into a 3-liter glass container, and acetaldehyde (amount B) is measured after light having a peak wavelength of 460 nm±10 nm is irradiated to the mixture for 2 hours to measure the decomposition ability (%): Decomposition ability (%)=[(acetaldehyde amount A?acetaldehyde amount B)/acetaldehyde amount A]×100.Type: GrantFiled: August 1, 2008Date of Patent: March 26, 2013Assignee: Toshiba Materials Co., Ltd.Inventors: Kayo Nakano, Akira Sato, Yasuhiro Shirakawa, Masami Okamura, Ryotaro Matsuda, Takaya Kamakura, Kazunari Otsuka, Kiyoshi Yokokura, Hideki Okawa, Ariyoshi Ishizaki
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Publication number: 20090023583Abstract: An object of the invention is to provide a photocatalyst material having a higher catalyst effect than conventional photocatalyst materials. The photocatalyst material of the invention contains, as its major component, a tungsten oxide powder excited by a light source which emits light having a wavelength of 430 to 500 nm, the photocatalyst material having a decomposition ability of 50% or more wherein the decomposition ability is given by the following equation based on the following test: [Test for Decomposition Ability] 1 g of a tungsten oxide powder and 20 ppm of acetaldehyde (amount A) are poured into a 3-liter glass container, and acetaldehyde (amount B) is measured after light having a peak wavelength of 460 nm±10 nm is irradiated to the mixture for 2 hours to measure the decomposition ability (%): Decomposition ability(%)=[(acetaldehyde amount A?acetaldehyde amount B)/acetaldehyde amount A]×100.Type: ApplicationFiled: August 1, 2008Publication date: January 22, 2009Inventors: Kayo Nakano, Akira Sato, Yasuhiro Shirakawa, Masami Okamura, Ryotaro Matsuda, Takaya Kamakura, Kazunari Otsuka, Kiyoshi Yokokura, Hideki Okawa, Ariyoshi Ishizaki
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Publication number: 20070177372Abstract: A photocatalytic material containing tungsten trioxide fine particles having an average particle diameter of 0.5 ?m or smaller and a crystal structure of a monoclinic crystal system as a main component.Type: ApplicationFiled: January 31, 2007Publication date: August 2, 2007Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Ryotaro Matsuda, Takaya Kamakura, Hideki Okawa, Ariyoshi Ishizaki