Patents by Inventor Hideki Oohata
Hideki Oohata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8379369Abstract: The invention relates to a substrate for solid electrolytic capacitor, wherein a first layer in the shielding layer formed by laminating a plurality of layers on top of each other, provided in an area for separating an anode part and a cathode part of the substrate for a solid electrolytic capacitor having a porous layer on its surface from a solution or dispersion of a heat resistant resin or its precursor, free from a shielding layer modification additive (except for a silane coupling agent) or containing a shielding layer modification additive content of not more than 0.1% by mass (based on the mass of the heat resistant resin or its precursor). The present invention enables to provide a method for producing a substrate for a solid electrolytic capacitor comprising a shielding layer made of a masking material which ensures the insulation between the anode part and the cathode part of the solid electrolytic capacitor; and a solid electrolytic capacitor using the substrate.Type: GrantFiled: September 21, 2007Date of Patent: February 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Hirofumi Fukunaga, Hideki Oohata
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Patent number: 8174820Abstract: An element for a solid electrolytic capacitor having low equivalent series resistance (ESR) and high capacitance per unit volume obtained by controlling the composition or the thickness of the silver paste forming a laminated structure on the anode substrate having a carbon paste layer on the surface. Using two kinds of silver pastes each having different wettability on the carbon paste layer and applying each silver paste on the side (edge) portions and face portions of an anode substrate, respectively, a desired layer thickness can be obtained as a whole. A solid electrolytic capacitor element preferably has a silver paste layer coating the side (edge) portions of the anode substrate which is thicker than the silver paste layer covering the face portions of the anode substrate, wherein a silver paste of composition having a water amount of 0.5 mass % or less is preferably used.Type: GrantFiled: November 8, 2006Date of Patent: May 8, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Isao Kabe, Hideki Oohata
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Publication number: 20110026190Abstract: A solid electrolyte capacitor comprising a solid electrolyte capacitor substrate having a porous surface layer or layers on the surface or surfaces of the substrate, which substrate has a masking layer in the boundary region between an anode region of the substrate and a cathode region of the substrate, wherein said masking layer has been formed from a solution or dispersion of a heat-resistant resin or a precursor thereof; and said masking layer contains 0% to 0.1% by mass, based on the mass of the heat-resistant resin or the precursor, of an additive for modifying the masking layer, which additive is other than a silane coupling agent. The masking layer exhibits a high insulation and the solid electrolyte capacitor has enhanced reliability.Type: ApplicationFiled: November 22, 2006Publication date: February 3, 2011Applicant: SHOWA DENKO K.K.Inventor: Hideki Oohata
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Patent number: 7848083Abstract: The invention relates to a substrate for solid electrolytic capacitor and a method for producing solid electrolytic capacitors using the substrate. By reducing at least part of the porous layer on the surface between the anode part region and the cathode part region of the substrate and preferably filling the dent generated by the reduction with a masking material, a structure ensuring insulation between the anode and the cathode can be obtained and solid electrolytic capacitors excellent in leakage current property and reliability can be obtained.Type: GrantFiled: June 22, 2006Date of Patent: December 7, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Hideki Oohata, Yoshihiro Saida, Masayuki Shinoda
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Publication number: 20100103589Abstract: The invention relates to a substrate for solid electrolytic capacitor, wherein a first layer in the shielding layer formed by laminating a plurality of layers on top of each other, provided in an area for separating an anode part and a cathode part of the substrate for a solid electrolytic capacitor having a porous layer on its surface from a solution or dispersion of a heat resistant resin or its precursor, free from a shielding layer modification additive (except for a silane coupling agent) or containing a shielding layer modification additive content of not more than 0.1% by mass (based on the mass of the heat resistant resin or its precursor). The present invention enables to provide a method for producing a substrate for a solid electrolytic capacitor comprising a shielding layer made of a masking material which ensures the insulation between the anode part and the cathode part of the solid electrolytic capacitor; and a solid electrolytic capacitor using the substrate.Type: ApplicationFiled: September 21, 2007Publication date: April 29, 2010Applicant: SHOWA DENKO K.K.Inventors: Hirofumi Fukunaga, Hideki Oohata
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Patent number: 7697267Abstract: The present invention relates to a capacitor having high capacitance, low ESR (equivalent series resistance) in a high-frequency region and low leakage current, including a composite oxide film obtained by reaction of an oxide film obtained by subjecting the surface of the substrate comprising valve-acting metal element to electrolytic oxidation with a solution in which metal ion and an organic base are dissolved and by subsequently sintering the reactant, a solid electrolyte formed on the composite oxide film and a conductor layer formed thereon; a method for producing the same and electronic devices using the same.Type: GrantFiled: December 27, 2006Date of Patent: April 13, 2010Assignee: Showa Denko K.K.Inventors: Hideki Oohata, Akihiko Shirakawa
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Publication number: 20100039751Abstract: The invention relates to a substrate for solid electrolytic capacitor and a method for producing solid electrolytic capacitors using the substrate. By reducing at least part of the porous layer on the surface between the anode part region and the cathode part region of the substrate and preferably filling the dent generated by the reduction with a masking material, a structure ensuring insulation between the anode and the cathode can be obtained and solid electrolytic capacitors excellent in leakage current property and reliability can be obtained.Type: ApplicationFiled: June 22, 2006Publication date: February 18, 2010Applicant: SHOWA DENKO K.K.Inventors: Hideki Oohata, Yoshihiro Saida, Masayuki Shinoda
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Publication number: 20090303665Abstract: A solid electrolytic capacitor comprising a solid electrolyte comprised of an electroconductive polymer, formed on a metal substrate with a valve action having a dielectric film formed on the surface thereof, characterized in that the dielectric film has a thickness of at least 30 nm, and the solid electrolyte contains 0.1% to 20% by mol, based on the total monomer units constituting the electroconductive polymer, of an anion of an aromatic compound, preferably an aromatic polycyclic compound having an aromatic polycyclic structure as basic skeleton and containing a Br?nsted acid group, as a dopant.Type: ApplicationFiled: December 27, 2006Publication date: December 10, 2009Applicant: Showa Denko K.K.Inventor: Hideki Oohata
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Patent number: 7495892Abstract: The present invention relates to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and having a cut surface which is formed by elongation of the valve-acting metal layer without fine pores dragged by a cutting blade; particularly to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and a layer of the elongated valve-acting metal which is generated by that the valve-acting metal layer without fine pores is elongated being dragged along with a cutting blade and covers the edge part of the valve-acting layer having fine pores meets the requirement represented by the following formula: 0?y/z?1??[Formula 1] wherein y represents the thickness of the layer of the elongated valve-actinType: GrantFiled: April 26, 2006Date of Patent: February 24, 2009Assignee: Showa Denko K.K.Inventors: Yoshihiro Saida, Yoshifumi Asai, Hideki Oohata
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Publication number: 20090034163Abstract: An element for a solid electrolytic capacitor having low equivalent series resistance (ESR) and high capacitance per unit volume obtained by controlling the composition or the thickness of the silver paste forming a laminated structure on the anode substrate having a carbon paste layer on the surface. Using two kinds of silver pastes each having different wettability on the carbon paste layer and applying each silver paste on the side (edge) portions and face portions of an anode substrate, respectively, a desired layer thickness can be obtained as a whole. A solid electrolytic capacitor element preferably has a silver paste layer coating the side (edge) portions of the anode substrate which is thicker than the silver paste layer covering the face portions of the anode substrate, wherein a silver paste of composition having a water amount of 0.5 mass % or less is preferably used.Type: ApplicationFiled: November 8, 2006Publication date: February 5, 2009Applicant: SHOWA DENKO K.K.Inventors: Isao Kabe, Hideki Oohata
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Publication number: 20080316681Abstract: The present invention relates to a capacitor having high capacitance, low ESR (equivalent series resistance) in a high-frequency region and low leakage current, comprising a composite oxide film obtained by reaction of an oxide film obtained by subjecting the surface of the substrate comprising valve-acting metal element with a solution in which metal ion and an organic base are dissolved and by subsequently sintering the reactant, a solid electrolyte formed on the composite oxide film and a conductor layer formed thereon; a method for producing the same and electronic devices using the same.Type: ApplicationFiled: December 27, 2006Publication date: December 25, 2008Applicant: SHOWA DENKO K.K.Inventors: Hideki Oohata, Akihiko Shirakawa
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Publication number: 20080125571Abstract: The present invention provides a process for producing a conductive polymer, characterized by comprising conducting polymerization in the presence of a polymerizable monomer, a surfactant, a solvent and an oxidizing agent under initial conditions that a concentration of the polymerizable monomer is from 0.20 to 2.8 mol/L and a molar ratio of the surfactant is from 0.8 to 1.6 mol per mol of the polymerizable monomer; and a conductive polymer obtained by the method. Since the conductive polymer of the present invention has high conductivity, it is useful as constituent members of electrochemical elements.Type: ApplicationFiled: October 12, 2005Publication date: May 29, 2008Applicants: Showa Denko K.K.,, Tokyo Institute of TechnologyInventors: Hideki Oohata, Yong Lei, Takakazu Yamamoto
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Publication number: 20070030622Abstract: The present invention relates to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and having a cut surface which is formed by elongation of the valve-acting metal layer without fine pores dragged by a cutting blade; particularly to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and a layer of the elongated valve-acting metal which is generated by that the valve-acting metal layer without fine pores is elongated being dragged along with a cutting blade and covers the edge part of the valve-acting layer having fine pores meets the requirement represented by the following formula: 0?y/z?1??[Formula 1] wherein y represents the thickness of the layer of the elongated valve-actingType: ApplicationFiled: April 26, 2006Publication date: February 8, 2007Inventors: Yoshihiro Saida, Yoshifumi Asai, Hideki Oohata
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Patent number: 5910187Abstract: Method of detecting yarn unevenness appearing as periodic variations of a spun yarn. First, plural yarn samples are taken. Then, k distinct spectrograms are obtained according to the number of the samples. These k spectrums are averaged to create an overall spectrogram. The height of adjacent channels in the overall spectrogram are averaged to create a reference spectrogram. Either the overall spectrogram of the distinct spectrograms are compared with the reference spectrogram of find those portions of the channels that exceed the reference spectrograms in height. These exceeding portions are displayed. Therefore, realistic defective added nonuniformities contained in the spun yarn can be easily detected.Type: GrantFiled: May 30, 1997Date of Patent: June 8, 1999Assignee: Keisokki Kogyo Co., Ltd.Inventors: Kazuhiko Okuda, Hideki Oohata