Patents by Inventor Hideki OOYAMA

Hideki OOYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through hole filling paste
    Patent number: 11259412
    Abstract: Through hole filling pastes which include a magnetic powder (A), an epoxy resin (B), and a curing agent (C), in which the magnetic powder (A) is surface-treated with a surface treating agent containing at least one element selected from Si, Al, and Ti, are capable of achieving a cured product excellent in plating adhesion.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: February 22, 2022
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hideki Ooyama, Takayuki Tanaka, Eiichi Hayashi
  • THROUGH HOLE FILLING PASTE
    Publication number: 20200413542
    Abstract: Through hole filling pastes which include a magnetic powder (A), an epoxy resin (B), and a curing agent (C), in which the magnetic powder (A) is surface-treated with a surface treating agent containing at least one element selected from Si, Al, and Ti, are capable of achieving a cured product excellent in plating adhesion.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 31, 2020
    Applicant: Ajinomoto Co., Inc.
    Inventors: Hideki OOYAMA, Takayuki TANAKA, Eiichi HAYASHI