Abstract: A method for producing a through electrode includes providing a semiconductor wafer having an integrated circuit provided on a surface of the semiconductor wafer and a hole provided in the semiconductor wafer along a thickness direction of the semiconductor wafer. At least a portion of a back surface of an electrode of the integrated circuit is exposed through the hole. A positive photosensitive resin composition is sprayed to form a coating film so that the coating film covers an inner surface of the hole. The positive photosensitive resin composition has a viscosity of 0.5 to 200 cP and includes an alkali-soluble resin, a compound which generates an acid when exposed to light, and a solvent. At least a portion of the coating film is exposed and developed to form a coating film pattern.

Abstract: A method for producing a through electrode includes providing a semiconductor wafer having an integrated circuit provided on a surface of the semiconductor wafer and a hole provided in the semiconductor wafer along a thickness direction of the semiconductor wafer. At least a portion of a back surface of an electrode of the integrated circuit is exposed through the hole. A positive photosensitive resin composition is sprayed to form a coating film so that the coating film covers an inner surface of the hole. The positive photosensitive resin composition has a viscosity of 0.5 to 200 cP and includes an alkali-soluble resin, a compound which generates an acid when exposed to light, and a solvent. At least a portion of the coating film is exposed and developed to form a coating film pattern.

Abstract: The present invention provides a positive photosensitive resin composition for spray coating, which comprises an alkali-soluble resin, a compound which generates an acid when exposed to light and a solvent, and which has a viscosity of 0.5 to 200 cP. By using the positive photosensitive resin composition, it is possible to form a coating film having a uniform thickness on the inner surface of a hole having a high aspect ratio. By using a coating film pattern, which is obtained by exposing and developing a predetermined region of the obtained coating film, as an insulating film or mask for forming an insulating film pattern, it is possible to suppress generation of leakage current in a hole and to form a through electrode with a high yield.

Abstract: A positive photosensitive resin composition for spray coating of the present invention is used for forming a coating film onto a substrate such as a semiconductor element mounting substrate, a ceramics substrate or an aluminium substrate by spray coating. The positive photosensitive resin composition is characterized by containing (A) an alkali soluble resin, (B) a compound which generates an acid by the action of light and (C) a solvent, and having a viscosity of 2 to 200 cP.