Abstract: According to one embodiment, a solid state imaging device includes a semiconductor substrate, a photodiode formed in the semiconductor substrate, a first insulating film having a first refractive index, and disposed on a surface of the semiconductor substrate, a second insulating film having a second refractive index higher than the first refractive index, and formed on the first insulating film above the photodiode, a third insulating film having a third refractive index higher than the second refractive index, and formed on the second insulating film above the photodiode, and a micro lens provided above the photodiode.

Abstract: A semiconductor device having a conductive layer comprising: a semiconductor substrate; a first interlayer insulating film formed above the semiconductor substrate; a first conductive layer formed in the first interlayer insulating film; a second interlayer insulating film formed on the first interlayer insulating film and the first conductive film; a contact that is formed in the second interlayer insulating film, an one end of the contact being electrically connected to the first conductive layer; a second conductive layer formed on the second interlayer insulting film and the contact; and a dummy pattern formed in the first conductive layer and adjacent to the one end of the contact, an upper surface of the dummy pattern reaching a lower surface of the second interlayer insulating film that is formed on the first conductive layer, and the lower surface of the dummy pattern reaching the first interlayer insulating film that is formed under the first conductive layer.