Abstract: A cassette loading device includes a dust protection mechanism having a dustproof lid member provided on the cassette, and the dustproof lid member is closed when an access to the recording medium is judged to be unnecessary even in the course of holding the cassette loaded in the recording and/or reproducing apparatus. Thus, the loading condition of the cassette is released with the dustproof lid member closed under the control of the loading control mechanism, and therefore the surface of the recording medium can be effectively prevented from being stuck with dust.

Abstract: There is described a wafer processing apparatus intended to efficiently secure a wafer on an electrostatic chuck. A heater is disposed in a processing chamber for heating a wafer, and a dielectric plate for supporting the wafer is also disposed in the processing chamber. First and second electrodes are embedded in the dielectric plate, and first and second variable D.C. power supplies are disposed so as to supply voltages to the first and second electrodes, respectively. After the wafer has been placed on an electrostatic chuck, the wafer is pre-heated before being subjected to attraction force. After completion of the pre-heating phase, the first and second D.C. power supplies supply voltages to the first and second electrodes, thus securing the wafer on the dielectric plate.

Abstract: There is described a wafer processing apparatus intended to efficiently secure a wafer on an electrostatic chuck. A heater is disposed in a processing chamber for heating a wafer, and a dielectric plate for supporting the wafer is also disposed in the processing chamber. First and second electrodes are embedded in the dielectric plate, and first and second variable D.C. power supplies are disposed so as to supply voltages to the first and second electrodes, respectively. After the wafer has been placed on an electrostatic chuck, the wafer is pre-heated before being subjected to attraction force. After completion of the pre-heating phase, the first and second D.C. power supplies supply voltages to the first and second electrodes, thus securing the wafer on the dielectric plate.